AMD Radeon RX 580X Mobile vs NVIDIA Tesla V100 DGXS

Comparative analysis of AMD Radeon RX 580X Mobile and NVIDIA Tesla V100 DGXS videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: Geekbench - OpenCL.

 

Differences

Reasons to consider the AMD Radeon RX 580X Mobile

  • Around 22% higher core clock speed: 1000 MHz vs 823 MHz
  • Around 17% higher boost clock speed: 1077 MHz vs 918 MHz
  • 2.5x lower typical power consumption: 100 Watt vs 250 Watt
  • 4.6x more memory clock speed: 8000 MHz vs 1752 MHz
Core clock speed 1000 MHz vs 823 MHz
Boost clock speed 1077 MHz vs 918 MHz
Thermal Design Power (TDP) 100 Watt vs 250 Watt
Memory clock speed 8000 MHz vs 1752 MHz

Reasons to consider the NVIDIA Tesla V100 DGXS

  • 3x more texture fill rate: 463.0 GTexel / s vs 155.1 GTexel / s
  • 2.2x more pipelines: 5120 vs 2304
  • 3x better floating-point performance: 14,817 gflops vs 4,963 gflops
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 12 nm vs 14 nm
  • 4x more maximum memory size: 32 GB vs 8 GB
Texture fill rate 463.0 GTexel / s vs 155.1 GTexel / s
Pipelines 5120 vs 2304
Floating-point performance 14,817 gflops vs 4,963 gflops
Manufacturing process technology 12 nm vs 14 nm
Maximum memory size 32 GB vs 8 GB

Compare benchmarks

GPU 1: AMD Radeon RX 580X Mobile
GPU 2: NVIDIA Tesla V100 DGXS

Name AMD Radeon RX 580X Mobile NVIDIA Tesla V100 DGXS
Geekbench - OpenCL 161295

Compare specifications (specs)

AMD Radeon RX 580X Mobile NVIDIA Tesla V100 DGXS

Essentials

Architecture GCN 4.0 Volta
Code name Polaris 20 GV100
Launch date 11 April 2018 27 March 2018
Place in performance rating not rated 59
Type Laptop Workstation

Technical info

Boost clock speed 1077 MHz 918 MHz
Core clock speed 1000 MHz 823 MHz
Floating-point performance 4,963 gflops 14,817 gflops
Manufacturing process technology 14 nm 12 nm
Pipelines 2304 5120
Texture fill rate 155.1 GTexel / s 463.0 GTexel / s
Thermal Design Power (TDP) 100 Watt 250 Watt
Transistor count 5,700 million 21,100 million

Video outputs and ports

Display Connectors No outputs No outputs

Compatibility, dimensions and requirements

Interface MXM-B (3.0) PCIe 3.0 x16
Supplementary power connectors None

API support

DirectX 12.0 (12_0) 12.0 (12_1)
OpenGL 4.5 4.6

Memory

Maximum RAM amount 8 GB 32 GB
Memory bandwidth 256.0 GB / s 897.0 GB / s
Memory bus width 256 Bit 4096 Bit
Memory clock speed 8000 MHz 1752 MHz
Memory type GDDR5 HBM2

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