ATI Mobility Radeon HD 3450 vs ATI Radeon X700

Comparative analysis of ATI Mobility Radeon HD 3450 and ATI Radeon X700 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark.

 

Differences

Reasons to consider the ATI Mobility Radeon HD 3450

  • Videocard is newer: launch date 3 year(s) 4 month(s) later
  • Around 25% higher core clock speed: 500 MHz vs 400 MHz
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 55 nm vs 110 nm
  • 3.7x lower typical power consumption: 12 Watt vs 44 Watt
  • 2x more maximum memory size: 256 MB vs 128 MB
  • Around 60% higher memory clock speed: 800 MHz vs 500 MHz
  • Around 25% better performance in PassMark - G3D Mark: 91 vs 73
Specifications (specs)
Launch date 7 January 2008 vs 1 September 2004
Core clock speed 500 MHz vs 400 MHz
Manufacturing process technology 55 nm vs 110 nm
Thermal Design Power (TDP) 12 Watt vs 44 Watt
Maximum memory size 256 MB vs 128 MB
Memory clock speed 800 MHz vs 500 MHz
Benchmarks
PassMark - G3D Mark 91 vs 73

Reasons to consider the ATI Radeon X700

  • Around 60% higher texture fill rate: 3.2 GTexel / s vs 2 GTexel / s
Specifications (specs)
Texture fill rate 3.2 GTexel / s vs 2 GTexel / s
Benchmarks
PassMark - G2D Mark 248 vs 247

Compare benchmarks

GPU 1: ATI Mobility Radeon HD 3450
GPU 2: ATI Radeon X700

PassMark - G3D Mark
GPU 1
GPU 2
91
73
PassMark - G2D Mark
GPU 1
GPU 2
247
248
Name ATI Mobility Radeon HD 3450 ATI Radeon X700
PassMark - G3D Mark 91 73
PassMark - G2D Mark 247 248

Compare specifications (specs)

ATI Mobility Radeon HD 3450 ATI Radeon X700

Essentials

Architecture TeraScale R400
Code name M82 RV410
Launch date 7 January 2008 1 September 2004
Place in performance rating 685 688
Type Laptop Desktop

Technical info

Core clock speed 500 MHz 400 MHz
Floating-point performance 40 gflops
Manufacturing process technology 55 nm 110 nm
Pipelines 40
Texture fill rate 2 GTexel / s 3.2 GTexel / s
Thermal Design Power (TDP) 12 Watt 44 Watt
Transistor count 181 million 120 million

Video outputs and ports

Display Connectors No outputs 1x DVI, 1x VGA, 1x S-Video

Compatibility, dimensions and requirements

Interface MXM-II PCIe 1.0 x16
Supplementary power connectors None

API support

DirectX 10.1 9.0b
OpenGL 3.3 2.0

Memory

Maximum RAM amount 256 MB 128 MB
Memory bandwidth 6.4 GB / s 8 GB / s
Memory bus width 64 Bit 128 Bit
Memory clock speed 800 MHz 500 MHz
Memory type DDR2 / GDDR3 DDR
Shared memory 0

Technologies

Powerplay