ATI Mobility Radeon HD 4850 Mac Edition vs ATI FirePro M7740

Comparative analysis of ATI Mobility Radeon HD 4850 Mac Edition and ATI FirePro M7740 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

ATI Mobility Radeon HD 4850 Mac Edition

ATI FirePro M7740

Differences

Reasons to consider the ATI Mobility Radeon HD 4850 Mac Edition

Around 25% higher pipelines: 800 vs 640

Pipelines	800 vs 640

Reasons to consider the ATI FirePro M7740

Around 29% higher core clock speed: 650 MHz vs 503 MHz
Around 3% higher texture fill rate: 20.8 GTexel / s vs 20.12 GTexel / s
Around 3% better floating-point performance: 832.0 gflops vs 804.8 gflops
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 40 nm vs 55 nm
2x more maximum memory size: 1 GB vs 512 MB
Around 99% higher memory clock speed: 3384 MHz vs 1700 MHz

Core clock speed	650 MHz vs 503 MHz
Texture fill rate	20.8 GTexel / s vs 20.12 GTexel / s
Floating-point performance	832.0 gflops vs 804.8 gflops
Manufacturing process technology	40 nm vs 55 nm
Maximum memory size	1 GB vs 512 MB
Memory clock speed	3384 MHz vs 1700 MHz

Compare benchmarks

GPU 1: ATI Mobility Radeon HD 4850 Mac Edition
GPU 2: ATI FirePro M7740

Name	ATI Mobility Radeon HD 4850 Mac Edition	ATI FirePro M7740
PassMark - G3D Mark		665
PassMark - G2D Mark		415
GFXBench 4.0 - T-Rex (Frames)		3309
GFXBench 4.0 - T-Rex (Fps)		3309

Compare specifications (specs)

	ATI Mobility Radeon HD 4850 Mac Edition	ATI FirePro M7740
Essentials
Architecture	TeraScale	TeraScale
Code name	M98	M97
Launch date	28 August 2009	4 August 2009
Place in performance rating	not rated	600
Type	Desktop	Mobile workstation
Technical info
Core clock speed	503 MHz	650 MHz
Floating-point performance	804.8 gflops	832.0 gflops
Manufacturing process technology	55 nm	40 nm
Pipelines	800	640
Texture fill rate	20.12 GTexel / s	20.8 GTexel / s
Transistor count	956 million	826 million
Thermal Design Power (TDP)		60 Watt
Video outputs and ports
Display Connectors	No outputs	No outputs
Compatibility, dimensions and requirements
Interface	PCIe 2.0 x16	PCIe 2.0 x16
Laptop size		large
Supplementary power connectors		None
API support
DirectX	10.1	10.1
OpenGL	3.3	3.3
Memory
Maximum RAM amount	512 MB	1 GB
Memory bandwidth	54.4 GB / s	54.1 GB / s
Memory bus width	256 Bit	128 Bit
Memory clock speed	1700 MHz	3384 MHz
Memory type	GDDR3	GDDR5
Shared memory		0