NVIDIA GeForce GT 140 OEM vs ATI Mobility Radeon X2300 HD

Comparative analysis of NVIDIA GeForce GT 140 OEM and ATI Mobility Radeon X2300 HD videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G2D Mark, PassMark - G3D Mark.

 

Differences

Reasons to consider the NVIDIA GeForce GT 140 OEM

  • Videocard is newer: launch date 2 year(s) 0 month(s) later
  • Around 36% higher core clock speed: 650 MHz vs 479 MHz
  • 10.9x more texture fill rate: 20.8 GTexel / s vs 1.916 GTexel / s
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 55 nm vs 80 nm
  • 4x more maximum memory size: 1 GB vs 256 MB
  • 2.4x more memory clock speed: 1800 MHz vs 756 MHz
  • 13.4x better performance in PassMark - G3D Mark: 658 vs 49
Specifications (specs)
Launch date 10 March 2009 vs 1 March 2007
Core clock speed 650 MHz vs 479 MHz
Texture fill rate 20.8 GTexel / s vs 1.916 GTexel / s
Manufacturing process technology 55 nm vs 80 nm
Maximum memory size 1 GB vs 256 MB
Memory clock speed 1800 MHz vs 756 MHz
Benchmarks
PassMark - G3D Mark 658 vs 49

Reasons to consider the ATI Mobility Radeon X2300 HD

  • Around 8% better performance in PassMark - G2D Mark: 244 vs 225
Benchmarks
PassMark - G2D Mark 244 vs 225

Compare benchmarks

GPU 1: NVIDIA GeForce GT 140 OEM
GPU 2: ATI Mobility Radeon X2300 HD

PassMark - G2D Mark
GPU 1
GPU 2
225
244
PassMark - G3D Mark
GPU 1
GPU 2
658
49
Name NVIDIA GeForce GT 140 OEM ATI Mobility Radeon X2300 HD
PassMark - G2D Mark 225 244
PassMark - G3D Mark 658 49

Compare specifications (specs)

NVIDIA GeForce GT 140 OEM ATI Mobility Radeon X2300 HD

Essentials

Architecture Tesla R500
Code name G94B M71
Launch date 10 March 2009 1 March 2007
Place in performance rating 708 709
Type Desktop Desktop

Technical info

Core clock speed 650 MHz 479 MHz
Floating-point performance 208 gflops
Manufacturing process technology 55 nm 80 nm
Pipelines 64
Texture fill rate 20.8 GTexel / s 1.916 GTexel / s
Thermal Design Power (TDP) 105 Watt
Transistor count 505 million 107 million

Video outputs and ports

Display Connectors 2x DVI, 1x S-Video No outputs

Compatibility, dimensions and requirements

Interface PCIe 2.0 x16 PCIe 1.0 x16
Length 229 mm
Supplementary power connectors 1x 6-pin

API support

DirectX 10.0 9.0c
OpenGL 3.3 2.0

Memory

Maximum RAM amount 1 GB 256 MB
Memory bandwidth 57.6 GB / s 3.024 GB / s
Memory bus width 256 Bit 32 Bit
Memory clock speed 1800 MHz 756 MHz
Memory type GDDR3 DDR2