NVIDIA GeForce GT 415 OEM vs NVIDIA GeForce PCX 5900

Comparative analysis of NVIDIA GeForce GT 415 OEM and NVIDIA GeForce PCX 5900 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G2D Mark, PassMark - G3D Mark.

 

Differences

Reasons to consider the NVIDIA GeForce GT 415 OEM

  • Videocard is newer: launch date 7 year(s) 5 month(s) later
  • Around 79% higher core clock speed: 625 MHz vs 350 MHz
  • 7.1x more texture fill rate: 10 GTexel / s vs 1.4 GTexel / s
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 40 nm vs 130 nm
  • 4x more maximum memory size: 512 MB vs 128 MB
  • Around 21% higher memory clock speed: 666 MHz vs 550 MHz
  • 7.4x better performance in PassMark - G3D Mark: 251 vs 34
Specifications (specs)
Launch date 3 September 2010 vs 17 March 2003
Core clock speed 625 MHz vs 350 MHz
Texture fill rate 10 GTexel / s vs 1.4 GTexel / s
Manufacturing process technology 40 nm vs 130 nm
Maximum memory size 512 MB vs 128 MB
Memory clock speed 666 MHz vs 550 MHz
Benchmarks
PassMark - G3D Mark 251 vs 34

Reasons to consider the NVIDIA GeForce PCX 5900

  • Around 4% better performance in PassMark - G2D Mark: 258 vs 249
Benchmarks
PassMark - G2D Mark 258 vs 249

Compare benchmarks

GPU 1: NVIDIA GeForce GT 415 OEM
GPU 2: NVIDIA GeForce PCX 5900

PassMark - G2D Mark
GPU 1
GPU 2
249
258
PassMark - G3D Mark
GPU 1
GPU 2
251
34
Name NVIDIA GeForce GT 415 OEM NVIDIA GeForce PCX 5900
PassMark - G2D Mark 249 258
PassMark - G3D Mark 251 34

Compare specifications (specs)

NVIDIA GeForce GT 415 OEM NVIDIA GeForce PCX 5900

Essentials

Architecture Tesla 2.0 Rankine
Code name GT216 NV35
Launch date 3 September 2010 17 March 2003
Place in performance rating 661 662
Type Desktop Desktop

Technical info

Core clock speed 625 MHz 350 MHz
Floating-point performance 130.56 gflops
Manufacturing process technology 40 nm 130 nm
Pipelines 48
Texture fill rate 10 GTexel / s 1.4 GTexel / s
Thermal Design Power (TDP) 32 Watt
Transistor count 486 million 135 million

Video outputs and ports

Display Connectors 1x DVI, 1x HDMI, 1x VGA 1x DVI, 1x VGA, 1x S-Video

Compatibility, dimensions and requirements

Interface PCIe 2.0 x16 PCIe 1.0 x16
Length 168 mm
Supplementary power connectors None None

API support

DirectX 10.1 9.0a
OpenGL 3.3 1.5 (2.1)

Memory

Maximum RAM amount 512 MB 128 MB
Memory bandwidth 10.66 GB / s 17.6 GB / s
Memory bus width 128 Bit 256 Bit
Memory clock speed 666 MHz 550 MHz
Memory type DDR3 DDR