NVIDIA H100 PCIe 96 GB vs AMD Radeon RX 7900M

Comparative analysis of NVIDIA H100 PCIe 96 GB and AMD Radeon RX 7900M videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G2D Mark, PassMark - G3D Mark, Geekbench - OpenCL.

 

Differences

Reasons to consider the NVIDIA H100 PCIe 96 GB

  • Around 61% higher texture fill rate: 969.9 GTexel/s vs 601.9 GTexel/s
  • 3.7x more pipelines: 16896 vs 4608
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 4 nm vs 5 nm
  • 6x more maximum memory size: 96 GB vs 16 GB
Texture fill rate 969.9 GTexel/s vs 601.9 GTexel/s
Pipelines 16896 vs 4608
Manufacturing process technology 4 nm vs 5 nm
Maximum memory size 96 GB vs 16 GB

Reasons to consider the AMD Radeon RX 7900M

  • Videocard is newer: launch date 1 year(s) 6 month(s) later
  • Around 10% higher core clock speed: 1825 MHz vs 1665 MHz
  • Around 14% higher boost clock speed: 2090 MHz vs 1837 MHz
  • 3.9x lower typical power consumption: 180 Watt vs 700 Watt
  • Around 71% higher memory clock speed: 2250 MHz, 18 Gbps effective vs 1313 MHz, 2.6 Gbps effective
Launch date 19 Oct 2023 vs 22 Mar 2022
Core clock speed 1825 MHz vs 1665 MHz
Boost clock speed 2090 MHz vs 1837 MHz
Thermal Design Power (TDP) 180 Watt vs 700 Watt
Memory clock speed 2250 MHz, 18 Gbps effective vs 1313 MHz, 2.6 Gbps effective

Compare benchmarks

GPU 1: NVIDIA H100 PCIe 96 GB
GPU 2: AMD Radeon RX 7900M

Name NVIDIA H100 PCIe 96 GB AMD Radeon RX 7900M
PassMark - G2D Mark 916
PassMark - G3D Mark 22365
Geekbench - OpenCL 117210

Compare specifications (specs)

NVIDIA H100 PCIe 96 GB AMD Radeon RX 7900M

Essentials

Architecture Hopper RDNA 3.0
Code name GH100 Navi 31
Launch date 22 Mar 2022 19 Oct 2023
Place in performance rating not rated 39

Technical info

Boost clock speed 1837 MHz 2090 MHz
Core clock speed 1665 MHz 1825 MHz
Manufacturing process technology 4 nm 5 nm
Pipelines 16896 4608
Pixel fill rate 44.09 GPixel/s 267.5 GPixel/s
Texture fill rate 969.9 GTexel/s 601.9 GTexel/s
Thermal Design Power (TDP) 700 Watt 180 Watt
Transistor count 80000 million 57700 million
Compute units 72

Video outputs and ports

Display Connectors No outputs Portable Device Dependent

Compatibility, dimensions and requirements

Form factor SXM Module IGP
Interface PCIe 5.0 x16 PCIe 4.0 x16
Recommended system power (PSU) 1100 Watt
Supplementary power connectors 8-pin EPS None

API support

OpenCL 3.0 2.2
DirectX 12 Ultimate (12_2)
OpenGL 4.6
Shader Model 6.7
Vulkan

Memory

Maximum RAM amount 96 GB 16 GB
Memory bandwidth 1,681 GB/s 576.0 GB/s
Memory bus width 5120 bit 256 bit
Memory clock speed 1313 MHz, 2.6 Gbps effective 2250 MHz, 18 Gbps effective
Memory type HBM3 GDDR6

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