NVIDIA H100 PCIe 96 GB vs AMD Radeon RX 7900M

Comparative analysis of NVIDIA H100 PCIe 96 GB and AMD Radeon RX 7900M videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G2D Mark, PassMark - G3D Mark, Geekbench - OpenCL.

NVIDIA H100 PCIe 96 GB

AMD Radeon RX 7900M

Differences

Reasons to consider the NVIDIA H100 PCIe 96 GB

Around 61% higher texture fill rate: 969.9 GTexel/s vs 601.9 GTexel/s
3.7x more pipelines: 16896 vs 4608
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 4 nm vs 5 nm
6x more maximum memory size: 96 GB vs 16 GB

Texture fill rate	969.9 GTexel/s vs 601.9 GTexel/s
Pipelines	16896 vs 4608
Manufacturing process technology	4 nm vs 5 nm
Maximum memory size	96 GB vs 16 GB

Reasons to consider the AMD Radeon RX 7900M

Videocard is newer: launch date 1 year(s) 6 month(s) later
Around 10% higher core clock speed: 1825 MHz vs 1665 MHz
Around 14% higher boost clock speed: 2090 MHz vs 1837 MHz
3.9x lower typical power consumption: 180 Watt vs 700 Watt
Around 71% higher memory clock speed: 2250 MHz, 18 Gbps effective vs 1313 MHz, 2.6 Gbps effective

Launch date	19 Oct 2023 vs 22 Mar 2022
Core clock speed	1825 MHz vs 1665 MHz
Boost clock speed	2090 MHz vs 1837 MHz
Thermal Design Power (TDP)	180 Watt vs 700 Watt
Memory clock speed	2250 MHz, 18 Gbps effective vs 1313 MHz, 2.6 Gbps effective

Compare benchmarks

GPU 1: NVIDIA H100 PCIe 96 GB
GPU 2: AMD Radeon RX 7900M

Name	NVIDIA H100 PCIe 96 GB	AMD Radeon RX 7900M
PassMark - G2D Mark		894
PassMark - G3D Mark		21837
Geekbench - OpenCL		104371

Compare specifications (specs)

	NVIDIA H100 PCIe 96 GB	AMD Radeon RX 7900M
Essentials
Architecture	Hopper	RDNA 3.0
Code name	GH100	Navi 31
Launch date	22 Mar 2022	19 Oct 2023
Place in performance rating	not rated	44
Technical info
Boost clock speed	1837 MHz	2090 MHz
Core clock speed	1665 MHz	1825 MHz
Manufacturing process technology	4 nm	5 nm
Pipelines	16896	4608
Pixel fill rate	44.09 GPixel/s	267.5 GPixel/s
Texture fill rate	969.9 GTexel/s	601.9 GTexel/s
Thermal Design Power (TDP)	700 Watt	180 Watt
Transistor count	80000 million	57700 million
Compute units		72
Video outputs and ports
Display Connectors	No outputs	Portable Device Dependent
Compatibility, dimensions and requirements
Form factor	SXM Module	IGP
Interface	PCIe 5.0 x16	PCIe 4.0 x16
Recommended system power (PSU)	1100 Watt
Supplementary power connectors	8-pin EPS	None
API support
OpenCL	3.0	2.2
DirectX		12 Ultimate (12_2)
OpenGL		4.6
Shader Model		6.7
Vulkan
Memory
Maximum RAM amount	96 GB	16 GB
Memory bandwidth	1,681 GB/s	576.0 GB/s
Memory bus width	5120 bit	256 bit
Memory clock speed	1313 MHz, 2.6 Gbps effective	2250 MHz, 18 Gbps effective
Memory type	HBM3	GDDR6