NVIDIA Quadro 5010M vs ATI FireGL V3100

Comparative analysis of NVIDIA Quadro 5010M and ATI FireGL V3100 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, Geekbench - OpenCL.

NVIDIA Quadro 5010M

ATI FireGL V3100

Differences

Reasons to consider the NVIDIA Quadro 5010M

Videocard is newer: launch date 6 year(s) 5 month(s) later
Around 15% higher core clock speed: 450 MHz vs 391 MHz
13.8x more texture fill rate: 21.6 GTexel / s vs 1.564 GTexel / s
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 40 nm vs 110 nm
32x more maximum memory size: 4 GB vs 128 MB
6.6x more memory clock speed: 2600 MHz vs 392 MHz
31.9x better performance in PassMark - G3D Mark: 1691 vs 53
Around 8% better performance in PassMark - G2D Mark: 297 vs 275

Specifications (specs)
Launch date	22 February 2011 vs 1 September 2004
Core clock speed	450 MHz vs 391 MHz
Texture fill rate	21.6 GTexel / s vs 1.564 GTexel / s
Manufacturing process technology	40 nm vs 110 nm
Maximum memory size	4 GB vs 128 MB
Memory clock speed	2600 MHz vs 392 MHz
Benchmarks
PassMark - G3D Mark	1691 vs 53
PassMark - G2D Mark	297 vs 275

Compare benchmarks

GPU 1: NVIDIA Quadro 5010M
GPU 2: ATI FireGL V3100

PassMark - G3D Mark

GPU 1

GPU 2

1691

PassMark - G2D Mark

GPU 1

GPU 2

297

275

Name	NVIDIA Quadro 5010M	ATI FireGL V3100
PassMark - G3D Mark	1691	53
PassMark - G2D Mark	297	275
Geekbench - OpenCL	16261

Compare specifications (specs)

	NVIDIA Quadro 5010M	ATI FireGL V3100
Essentials
Architecture	Fermi 2.0	Rage 9
Code name	GF110	RV370
Launch date	22 February 2011	1 September 2004
Place in performance rating	605	607
Price now	$235.95
Type	Mobile workstation	Workstation
Value for money (0-100)	10.17
Technical info
Core clock speed	450 MHz	391 MHz
Floating-point performance	691.2 gflops
Manufacturing process technology	40 nm	110 nm
Pipelines	384
Texture fill rate	21.6 GTexel / s	1.564 GTexel / s
Thermal Design Power (TDP)	100 Watt
Transistor count	3,000 million	107 million
Video outputs and ports
Display Connectors	No outputs	No outputs
Compatibility, dimensions and requirements
Interface	MXM-B (3.0)	PCIe 1.0 x16
Laptop size	large
Supplementary power connectors		None
API support
DirectX	12.0 (11_0)	9.0
OpenGL	4.6	2.0
Memory
Maximum RAM amount	4 GB	128 MB
Memory bandwidth	83.2 GB / s	3.136 GB / s
Memory bus width	256 Bit	64 Bit
Memory clock speed	2600 MHz	392 MHz
Memory type	GDDR5 ECC	DDR
Shared memory	0
Technologies
ECC (Error Correcting Code)