NVIDIA Quadro 5010M vs NVIDIA GeForce 7350 LE

Comparative analysis of NVIDIA Quadro 5010M and NVIDIA GeForce 7350 LE videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, Geekbench - OpenCL.

 

Differences

Reasons to consider the NVIDIA Quadro 5010M

  • Videocard is newer: launch date 4 year(s) 11 month(s) later
  • 12x more texture fill rate: 21.6 GTexel / s vs 1.8 GTexel / s
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 40 nm vs 90 nm
  • 32x more maximum memory size: 4 GB vs 128 MB
  • 3.3x more memory clock speed: 2600 MHz vs 800 MHz
  • 22.9x better performance in PassMark - G3D Mark: 1691 vs 74
  • Around 6% better performance in PassMark - G2D Mark: 297 vs 281
Specifications (specs)
Launch date 22 February 2011 vs 22 March 2006
Texture fill rate 21.6 GTexel / s vs 1.8 GTexel / s
Manufacturing process technology 40 nm vs 90 nm
Maximum memory size 4 GB vs 128 MB
Memory clock speed 2600 MHz vs 800 MHz
Benchmarks
PassMark - G3D Mark 1691 vs 74
PassMark - G2D Mark 297 vs 281

Compare benchmarks

GPU 1: NVIDIA Quadro 5010M
GPU 2: NVIDIA GeForce 7350 LE

PassMark - G3D Mark
GPU 1
GPU 2
1691
74
PassMark - G2D Mark
GPU 1
GPU 2
297
281
Name NVIDIA Quadro 5010M NVIDIA GeForce 7350 LE
PassMark - G3D Mark 1691 74
PassMark - G2D Mark 297 281
Geekbench - OpenCL 16261

Compare specifications (specs)

NVIDIA Quadro 5010M NVIDIA GeForce 7350 LE

Essentials

Architecture Fermi 2.0 Curie
Code name GF110 G72
Launch date 22 February 2011 22 March 2006
Place in performance rating 619 622
Price now $235.95
Type Mobile workstation Desktop
Value for money (0-100) 10.17

Technical info

Core clock speed 450 MHz 450 MHz
Floating-point performance 691.2 gflops
Manufacturing process technology 40 nm 90 nm
Pipelines 384
Texture fill rate 21.6 GTexel / s 1.8 GTexel / s
Thermal Design Power (TDP) 100 Watt
Transistor count 3,000 million 112 million

Video outputs and ports

Display Connectors No outputs 1x DVI, 1x S-Video

Compatibility, dimensions and requirements

Interface MXM-B (3.0) PCIe 1.0 x16
Laptop size large
Supplementary power connectors None

API support

DirectX 12.0 (11_0) 9.0c
OpenGL 4.6 2.1

Memory

Maximum RAM amount 4 GB 128 MB
Memory bandwidth 83.2 GB / s 6.4 GB / s
Memory bus width 256 Bit 64 Bit
Memory clock speed 2600 MHz 800 MHz
Memory type GDDR5 ECC DDR2
Shared memory 0

Technologies

ECC (Error Correcting Code)