NVIDIA Tesla P100 SXM2 vs ATI FirePro RG220

Comparative analysis of NVIDIA Tesla P100 SXM2 and ATI FirePro RG220 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: Geekbench - OpenCL, PassMark - G2D Mark, PassMark - G3D Mark.

NVIDIA Tesla P100 SXM2

ATI FirePro RG220

Differences

Reasons to consider the NVIDIA Tesla P100 SXM2

Videocard is newer: launch date 7 year(s) 11 month(s) later
2.7x more core clock speed: 1328 MHz vs 500 MHz
82.9x more texture fill rate: 331.5 GTexel / s vs 4 GTexel / s
44.8x more pipelines: 3584 vs 80
132.6x better floating-point performance: 10,609 gflops vs 80 gflops
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 16 nm vs 55 nm
32x more maximum memory size: 16 GB vs 512 MB

Launch date	5 April 2016 vs 1 May 2008
Core clock speed	1328 MHz vs 500 MHz
Texture fill rate	331.5 GTexel / s vs 4 GTexel / s
Pipelines	3584 vs 80
Floating-point performance	10,609 gflops vs 80 gflops
Manufacturing process technology	16 nm vs 55 nm
Maximum memory size	16 GB vs 512 MB

Reasons to consider the ATI FirePro RG220

8.6x lower typical power consumption: 35 Watt vs 300 Watt
Around 14% higher memory clock speed: 1600 MHz vs 1408 MHz

Thermal Design Power (TDP)	35 Watt vs 300 Watt
Memory clock speed	1600 MHz vs 1408 MHz

Compare benchmarks

GPU 1: NVIDIA Tesla P100 SXM2
GPU 2: ATI FirePro RG220

Name	NVIDIA Tesla P100 SXM2	ATI FirePro RG220
Geekbench - OpenCL	76222
PassMark - G2D Mark		552
PassMark - G3D Mark		335

Compare specifications (specs)

	NVIDIA Tesla P100 SXM2	ATI FirePro RG220
Essentials
Architecture	Pascal	TeraScale
Code name	GP100	RV711
Launch date	5 April 2016	1 May 2008
Place in performance rating	250	251
Type	Desktop	Workstation
Technical info
Boost clock speed	1480 MHz
Core clock speed	1328 MHz	500 MHz
Floating-point performance	10,609 gflops	80 gflops
Manufacturing process technology	16 nm	55 nm
Pipelines	3584	80
Texture fill rate	331.5 GTexel / s	4 GTexel / s
Thermal Design Power (TDP)	300 Watt	35 Watt
Transistor count	15,300 million	242 million
Video outputs and ports
Display Connectors	No outputs	1x DMS-59
Compatibility, dimensions and requirements
Interface	PCIe 3.0 x16	PCIe 2.0 x16
Supplementary power connectors	None	None
API support
DirectX	12.0 (12_1)	10.1
OpenGL	4.6	3.3
Memory
Maximum RAM amount	16 GB	512 MB
Memory bandwidth	720.9 GB / s	51.2 GB / s
Memory bus width	4096 Bit	256 Bit
Memory clock speed	1408 MHz	1600 MHz
Memory type	HBM2	GDDR3