Nom de code de l’architecture |
Kaby Lake G |
Skylake |
Date de sortie |
10 January 2018 |
24 January 2016 |
Position dans l’évaluation de la performance |
1614 |
1625 |
Processor Number |
i7-8809G |
i7-6970HQ |
Série |
8th Generation Intel® Core™ i7 Processors |
6th Generation Intel® Core™ i7 Processors |
Status |
Announced |
Launched |
Segment vertical |
Mobile |
Mobile |
Prix de sortie (MSRP) |
|
$623 |
Soutien de 64-bit |
|
|
Base frequency |
3.10 GHz |
2.80 GHz |
Bus Speed |
8 GT/s DMI |
8 GT/s DMI3 |
Cache L1 |
256 KB |
256 KB |
Cache L2 |
1 MB |
1 MB |
Cache L3 |
8 MB |
8 MB |
Processus de fabrication |
14 nm |
14 nm |
Température maximale de la caisse (TCase) |
72 °C |
|
Température de noyau maximale |
100°C |
100°C |
Fréquence maximale |
4.20 GHz |
3.70 GHz |
Nombre de noyaux |
4 |
4 |
Nombre de fils |
8 |
8 |
Réseaux de mémoire maximale |
2 |
2 |
Bande passante de mémoire maximale |
37.5 GB/s |
34.1 GB/s |
Taille de mémore maximale |
64 GB |
64 GB |
Genres de mémoire soutenus |
DDR4-2400 |
DDR4-2133, LPDDR3-1866, DDR3L-1600 |
Graphics base frequency |
350 MHz |
350 MHz |
Graphics max dynamic frequency |
1.10 GHz |
1.05 GHz |
Technologie Intel® Clear Video HD |
|
|
Technologie Intel® Clear Video |
|
|
Technologie Intel® InTru™ 3D |
|
|
Intel® Quick Sync Video |
|
|
Mémoire de vidéo maximale |
64 GB |
64 GB |
Graphiques du processeur |
Intel® HD Graphics 630 |
Intel® Iris® Pro Graphics 580 |
Device ID |
|
0x193B |
eDRAM |
|
128 MB |
Freéquency maximale des graphiques |
|
1.05 GHz |
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Nombre d’écrans soutenu |
3 |
3 |
Soutien du Wireless Display (WiDi) |
|
|
Soutien de la resolution 4K |
|
|
Résolution maximale sur DisplayPort |
4096 x 2160 @60Hz |
4096x2304@60Hz |
Résolution maximale sur eDP |
4096 x 2160 @60Hz |
4096x2304@60Hz |
Résolution maximale sur HDMI 1.4 |
4096 x 2160 @30Hz |
4096x2304@24Hz |
Résolution maximale sur WiDi |
|
Up to 4096x2304@30Hz |
DirectX |
12 |
12 |
OpenGL |
4.4 |
4.5 |
Low Halogen Options Available |
|
|
Nombre de CPUs maximale dans une configuration |
1 |
1 |
Package Size |
31mm x 58.5mm |
42mm x 28mm |
Prise courants soutenu |
BGA2270 |
FCBGA1440 |
Thermal Design Power (TDP) |
100 Watt |
45 Watt |
Configurable TDP-down |
|
35 W |
Nombre maximale des voies PCIe |
8 |
16 |
Révision PCI Express |
3.0 |
3.0 |
PCIe configurations |
Up to 1x8, 2x4 |
Up to 1x16, 2x8, 1x8+2x4 |
Execute Disable Bit (EDB) |
|
|
Technologie Intel® Identity Protection |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Intel® OS Guard |
|
|
Technologie Intel® Secure Key |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
Idle States |
|
|
Extensions de l’ensemble d’instructions |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
Intel® AES New Instructions |
|
|
Intel® Flex Memory Access |
|
|
Technologie Intel® Hyper-Threading |
|
|
Technologie Intel® My WiFi |
|
|
Technologie Intel® Smart Response |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Intel® TSX-NI |
|
|
Technologie Intel® Turbo Boost |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Speed Shift technology |
|
|
Thermal Monitoring |
|
|
AMD Virtualization (AMD-V™) |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|