AMD Ryzen Embedded R1606G processor review
Ryzen Embedded R1606G processor released by AMD; release date: 16 Apr 2019. The processor is designed for embedded-computers and based on Zen microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2, threads - 4. Maximum CPU clock speed - 3.5 GHz. Manufacturing process technology - 14 nm. Cache size: L1 - 192 KB, L2 - 1 MB, L3 - 4 MB.
Supported memory types: DDR4-2400. Maximum memory size: 32 GB.
Power consumption (TDP): 15 Watt.
The processor has integrated graphics Radeon Vega 3 with the following parameters: maximum frequency - 1200 MHz.
Benchmarks
| PassMark Single thread mark |
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| PassMark CPU mark |
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| Name | Value |
|---|---|
| PassMark - Single thread mark | 1889 |
| PassMark - CPU mark | 4140 |
Integrated graphics – AMD Radeon Vega 3
Technical info |
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| Boost clock speed | 1000 MHz |
| Core clock speed | 300 MHz |
| Floating-point performance | 384.0 gflops |
| Manufacturing process technology | 14 nm |
| Pipelines | 192 |
| Texture fill rate | 12 GTexel / s |
| Thermal Design Power (TDP) | 15 Watt |
| Transistor count | 4,940 million |
Specifications (specs)
Essentials |
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| Architecture codename | Zen |
| Launch date | 16 Apr 2019 |
| Place in performance rating | 1353 |
| Processor Number | R1606G |
| Vertical segment | Embedded |
Performance |
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| Base frequency | 2.6 GHz |
| L1 cache | 192 KB |
| L2 cache | 1 MB |
| L3 cache | 4 MB |
| Manufacturing process technology | 14 nm |
| Maximum frequency | 3.5 GHz |
| Number of cores | 2 |
| Number of threads | 4 |
Memory |
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| Max memory channels | 2 |
| Maximum memory bandwidth | 35.76 GB/s |
| Maximum memory size | 32 GB |
| Supported memory types | DDR4-2400 |
Graphics |
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| Execution Units | 3 |
| Graphics max frequency | 1200 MHz |
| Number of pipelines | 192 |
| Processor graphics | Radeon Vega 3 |
Graphics interfaces |
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| DisplayPort | |
| eDP | |
| HDMI | |
| Number of displays supported | 3 |
Graphics API support |
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| DirectX | 12 |
| OpenGL | 4.6 |
Compatibility |
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| Configurable TDP-down | 12 Watt |
| Configurable TDP-up | 25 Watt |
| Thermal Design Power (TDP) | 15 Watt |
Peripherals |
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| Max number of PCIe lanes | 8 |
| PCI Express revision | 3.0 |
| PCIe configurations | x8 |
