Intel Atom D2550 processor review
Atom D2550 processor released by Intel; release date: 5 January 2012. The processor is designed for desktop-computers and based on Cedarview microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2, threads - 4. Maximum CPU clock speed - 1.86 GHz. Maximum operating temperature - 100 °C. Manufacturing process technology - 32 nm. Cache size: L1 - 64 KB (per core), L2 - 1024 KB.
Supported memory types: DDR3 800/1066. Maximum memory size: 4 GB.
Supported socket types: FCBGA559. Maximum number of processors in a configuration - 1. Power consumption (TDP): 10 Watt.
The processor has integrated graphics Integrated.
Benchmarks
| PassMark Single thread mark |
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| PassMark CPU mark |
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| Geekbench 4 Single Core |
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| Geekbench 4 Multi-Core |
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| Name | Value |
|---|---|
| PassMark - Single thread mark | 322 |
| PassMark - CPU mark | 409 |
| Geekbench 4 - Single Core | 95 |
| Geekbench 4 - Multi-Core | 271 |
Specifications (specs)
Essentials |
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| Architecture codename | Cedarview |
| Launch date | 5 January 2012 |
| Place in performance rating | 3275 |
| Processor Number | D2550 |
| Series | Intel® Atom™ Processor D Series |
| Status | Discontinued |
| Vertical segment | Desktop |
Performance |
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| 64 bit support | |
| Base frequency | 1.86 GHz |
| Die size | 66 mm |
| L1 cache | 64 KB (per core) |
| L2 cache | 1024 KB |
| Manufacturing process technology | 32 nm |
| Maximum core temperature | 100 °C |
| Maximum frequency | 1.86 GHz |
| Number of cores | 2 |
| Number of threads | 4 |
| Transistor count | 176 million |
| VID voltage range | 0.91V -1.21V |
Memory |
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| Max memory channels | 1 |
| Maximum memory bandwidth | 6.4 GB/s |
| Maximum memory size | 4 GB |
| Supported memory types | DDR3 800/1066 |
Graphics |
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| Graphics base frequency | 640 MHz |
| Processor graphics | Integrated |
Graphics interfaces |
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| Number of displays supported | 2 |
Compatibility |
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| Low Halogen Options Available | |
| Max number of CPUs in a configuration | 1 |
| Package Size | 22mm X 22 mm |
| Sockets supported | FCBGA559 |
| Thermal Design Power (TDP) | 10 Watt |
Peripherals |
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| Max number of PCIe lanes | 4 |
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | |
| Instruction set extensions | Intel® SSE2, Intel® SSE3, Intel® SSSE3 |
| Intel 64 | |
| Intel® Hyper-Threading technology | |
| Intel® Turbo Boost technology | |
| Intel® vPro™ Platform Eligibility | |
| Physical Address Extensions (PAE) | 36-bit |
Virtualization |
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| Intel® Virtualization Technology (VT-x) | |
| Intel® Virtualization Technology for Directed I/O (VT-d) | |
| Intel® Virtualization Technology for Itanium (VT-i) | |
Navigation
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