Intel Celeron 797 processor review
Celeron 797 processor released by Intel; release date: 1 November 2011. The processor is designed for mobile-computers and based on Sandy Bridge microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 1, threads - 1. Maximum CPU clock speed - 1.4 GHz. Maximum operating temperature - 100 °C. Manufacturing process technology - 32 nm. Cache size: L1 - 64 KB, L2 - 256 KB, L3 - 1.5 MB.
Supported memory types: DDR3 1066/1333. Maximum memory size: 16 GB.
Supported socket types: BGA1023. Maximum number of processors in a configuration - 1. Power consumption (TDP): 17 Watt.
The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 950 MHz.
Specifications (specs)
Essentials |
|
Architecture codename | Sandy Bridge |
Launch date | 1 November 2011 |
Place in performance rating | not rated |
Processor Number | 797 |
Series | Legacy Intel® Celeron® Processor |
Status | Launched |
Vertical segment | Mobile |
Performance |
|
64 bit support | |
Base frequency | 1.40 GHz |
Bus Speed | 5 GT/s DMI |
Die size | 131 mm |
L1 cache | 64 KB |
L2 cache | 256 KB |
L3 cache | 1.5 MB |
Manufacturing process technology | 32 nm |
Maximum core temperature | 100 °C |
Maximum frequency | 1.4 GHz |
Number of cores | 1 |
Number of threads | 1 |
Transistor count | 504 million |
Memory |
|
Max memory channels | 2 |
Maximum memory bandwidth | 21.3 GB/s |
Maximum memory size | 16 GB |
Supported memory types | DDR3 1066/1333 |
Graphics |
|
Graphics base frequency | 350 MHz |
Graphics max dynamic frequency | 950 MHz |
Graphics max frequency | 950 MHz |
Intel® Clear Video HD technology | |
Intel® Flexible Display Interface (Intel® FDI) | |
Intel® InTru™ 3D technology | |
Intel® Quick Sync Video | |
Processor graphics | Intel HD Graphics |
Graphics interfaces |
|
CRT | |
DisplayPort | |
eDP | |
HDMI | |
Number of displays supported | 2 |
SDVO | |
Wireless Display (WiDi) support | |
Compatibility |
|
Low Halogen Options Available | |
Max number of CPUs in a configuration | 1 |
Package Size | 31.0mm x 24.0mm (BGA1023) |
Sockets supported | BGA1023 |
Thermal Design Power (TDP) | 17 Watt |
Peripherals |
|
Max number of PCIe lanes | 16 |
PCI Express revision | 2.0 |
PCIe configurations | 1x16, 2x8, 1x8 2x4 |
Security & Reliability |
|
Anti-Theft technology | |
Execute Disable Bit (EDB) | |
Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
|
4G WiMAX Wireless | |
Enhanced Intel SpeedStep® technology | |
Flexible Display interface (FDI) | |
Idle States | |
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 | |
Intel® AES New Instructions | |
Intel® Demand Based Switching | |
Intel® Fast Memory Access | |
Intel® Flex Memory Access | |
Intel® Hyper-Threading technology | |
Intel® My WiFi technology | |
Intel® Turbo Boost technology | |
Intel® vPro™ Platform Eligibility | |
Thermal Monitoring | |
Virtualization |
|
Intel® Virtualization Technology (VT-x) | |
Intel® Virtualization Technology for Directed I/O (VT-d) |