Intel Celeron B710 processor review

Intel Celeron B710

Celeron B710 processor released by Intel; release date: 15 March 2011. The processor is designed for mobile-computers and based on Sandy Bridge microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 1, threads - 1. Maximum CPU clock speed - 1.6 GHz. Maximum operating temperature - 100C. Manufacturing process technology - 32 nm. Cache size: L1 - 64 KB, L2 - 256 KB, L3 - 1536 KB.

Supported memory types: DDR3 1066/1333. Maximum memory size: 16 GB.

Supported socket types: PGA988. Maximum number of processors in a configuration - 1. Power consumption (TDP): 35 Watt.

The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 1 GHz.

Benchmarks

PassMark
Single thread mark
Top 1 CPU
This CPU
4865
101
PassMark
CPU mark
Top 1 CPU
This CPU
157672
106
Name Value
PassMark - Single thread mark 101
PassMark - CPU mark 106

Specifications (specs)

Essentials

Architecture codename Sandy Bridge
Launch date 15 March 2011
Place in performance rating 3313
Processor Number B710
Series Legacy Intel® Celeron® Processor
Status Launched
Vertical segment Mobile

Performance

64 bit support
Base frequency 1.60 GHz
Die size 131 mm
L1 cache 64 KB
L2 cache 256 KB
L3 cache 1536 KB
Manufacturing process technology 32 nm
Maximum core temperature 100C
Maximum frequency 1.6 GHz
Number of cores 1
Number of threads 1
Transistor count 504 million

Memory

Max memory channels 2
Maximum memory bandwidth 21.3 GB/s
Maximum memory size 16 GB
Supported memory types DDR3 1066/1333

Graphics

Graphics base frequency 650 MHz
Graphics max dynamic frequency 1.00 GHz
Graphics max frequency 1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel HD Graphics

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 2
SDVO
Wireless Display (WiDi) support

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 37.5mmx37.5mm (rPGA988B)
Sockets supported PGA988
Thermal Design Power (TDP) 35 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16, 2x8, 1x8 2x4

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)

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