Intel Celeron B710 vs Intel Celeron Dual-Core T1700

Comparative analysis of Intel Celeron B710 and Intel Celeron Dual-Core T1700 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Celeron B710

Intel Celeron Dual-Core T1700

Differences

Reasons to consider the Intel Celeron B710

CPU is newer: launch date 2 year(s) 3 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm

Launch date	15 March 2011 vs 7 December 2008
Manufacturing process technology	32 nm vs 65 nm

Reasons to consider the Intel Celeron Dual-Core T1700

1 more cores, run more applications at once: 2 vs 1
1 more threads: 2 vs 1
Around 14% higher clock speed: 1.83 GHz vs 1.6 GHz
4x more L2 cache, more data can be stored in the L2 cache for quick access later
10x better performance in PassMark - CPU mark: 1058 vs 106

Specifications (specs)
Number of cores	2 vs 1
Number of threads	2 vs 1
Maximum frequency	1.83 GHz vs 1.6 GHz
L2 cache	1024 KB vs 256 KB
Benchmarks
PassMark - CPU mark	1058 vs 106

Compare benchmarks

CPU 1: Intel Celeron B710
CPU 2: Intel Celeron Dual-Core T1700

PassMark - CPU mark

CPU 1

CPU 2

106

1058

Name	Intel Celeron B710	Intel Celeron Dual-Core T1700
PassMark - Single thread mark	101	0
PassMark - CPU mark	106	1058

Compare specifications (specs)

	Intel Celeron B710	Intel Celeron Dual-Core T1700
Essentials
Architecture codename	Sandy Bridge	Merom
Launch date	15 March 2011	7 December 2008
Place in performance rating	3315	3323
Processor Number	B710	T1700
Series	Legacy Intel® Celeron® Processor	Legacy Intel® Celeron® Processor
Status	Launched	Discontinued
Vertical segment	Mobile	Mobile
Performance
64 bit support
Base frequency	1.60 GHz	1.83 GHz
Die size	131 mm	143 mm2
L1 cache	64 KB
L2 cache	256 KB	1024 KB
L3 cache	1536 KB
Manufacturing process technology	32 nm	65 nm
Maximum core temperature	100C	100°C
Maximum frequency	1.6 GHz	1.83 GHz
Number of cores	1	2
Number of threads	1	2
Transistor count	504 million	291 million
Bus Speed		667 MHz FSB
Front-side bus (FSB)		667 MHz
VID voltage range		1.075V-1.175V
Memory
Max memory channels	2
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	16 GB
Supported memory types	DDR3 1066/1333
Graphics
Graphics base frequency	650 MHz
Graphics max dynamic frequency	1.00 GHz
Graphics max frequency	1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	37.5mmx37.5mm (rPGA988B)	35mm x 35mm
Sockets supported	PGA988	PPGA478
Thermal Design Power (TDP)	35 Watt	35 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8 2x4
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
FSB parity
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)