Intel Atom Z670 vs Intel Celeron B710
Comparative analysis of Intel Atom Z670 and Intel Celeron B710 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Atom Z670
- 1 more threads: 2 vs 1
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 11.7x lower typical power consumption: 3 Watt vs 35 Watt
- Around 49% better performance in PassMark - CPU mark: 158 vs 106
Specifications (specs) | |
Number of threads | 2 vs 1 |
L2 cache | 512 KB (per core) vs 256 KB |
Thermal Design Power (TDP) | 3 Watt vs 35 Watt |
Benchmarks | |
PassMark - CPU mark | 158 vs 106 |
Reasons to consider the Intel Celeron B710
- Around 7% higher clock speed: 1.6 GHz vs 1.5 GHz
- Around 11% higher maximum core temperature: 100C vs 90
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- 5.5x more maximum memory size: 16 GB vs 2.93 GB
- Around 6% better performance in PassMark - Single thread mark: 101 vs 95
Specifications (specs) | |
Maximum frequency | 1.6 GHz vs 1.5 GHz |
Maximum core temperature | 100C vs 90 |
Manufacturing process technology | 32 nm vs 45 nm |
Maximum memory size | 16 GB vs 2.93 GB |
Benchmarks | |
PassMark - Single thread mark | 101 vs 95 |
Compare benchmarks
CPU 1: Intel Atom Z670
CPU 2: Intel Celeron B710
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Atom Z670 | Intel Celeron B710 |
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PassMark - Single thread mark | 95 | 101 |
PassMark - CPU mark | 158 | 106 |
Compare specifications (specs)
Intel Atom Z670 | Intel Celeron B710 | |
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Essentials |
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Architecture codename | Lincroft | Sandy Bridge |
Launch date | April 2011 | 15 March 2011 |
Place in performance rating | 3315 | 3313 |
Processor Number | Z670 | B710 |
Series | Legacy Intel Atom® Processors | Legacy Intel® Celeron® Processor |
Status | Discontinued | Launched |
Vertical segment | Mobile | Mobile |
Performance |
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Base frequency | 1.50 GHz | 1.60 GHz |
Die size | 65 mm | 131 mm |
L1 cache | 64 KB (per core) | 64 KB |
L2 cache | 512 KB (per core) | 256 KB |
Manufacturing process technology | 45 nm | 32 nm |
Maximum core temperature | 90 | 100C |
Maximum frequency | 1.5 GHz | 1.6 GHz |
Number of cores | 1 | 1 |
Number of threads | 2 | 1 |
Transistor count | 140 million | 504 million |
VID voltage range | 1.1125-1.5000V | |
64 bit support | ||
L3 cache | 1536 KB | |
Memory |
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Max memory channels | 1 | 2 |
Maximum memory size | 2.93 GB | 16 GB |
Supported memory types | DDR2 800 | DDR3 1066/1333 |
Maximum memory bandwidth | 21.3 GB/s | |
Graphics |
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Graphics base frequency | 400 MHz | 650 MHz |
Processor graphics | Integrated | Intel HD Graphics |
Graphics max dynamic frequency | 1.00 GHz | |
Graphics max frequency | 1 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Graphics interfaces |
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LVDS | ||
CRT | ||
DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 2 | |
SDVO | ||
Wireless Display (WiDi) support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 13.8mmx13.8mm | 37.5mmx37.5mm (rPGA988B) |
Sockets supported | T-PBGA518 | PGA988 |
Thermal Design Power (TDP) | 3 Watt | 35 Watt |
Peripherals |
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PCI support | ||
Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Anti-Theft technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE2, Intel® SSE3, Intel® SSSE3 | Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 | ||
Intel® Hyper-Threading technology | ||
Thermal Monitoring | ||
Flexible Display interface (FDI) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |