AMD A4-9120e vs Intel Celeron G1820TE

Comparative analysis of AMD A4-9120e and Intel Celeron G1820TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Advanced Technologies, Virtualization, Graphics interfaces, Peripherals, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

AMD A4-9120e

Intel Celeron G1820TE

Differences

Reasons to consider the AMD A4-9120e

Around 25% more L1 cache; more data can be stored in the L1 cache for quick access later
2x more L2 cache, more data can be stored in the L2 cache for quick access later

L1 cache	160 KB vs 64 KB (per core)
L2 cache	1 MB vs 256 KB (per core)

Reasons to consider the Intel Celeron G1820TE

A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 28 nm
Around 32% better performance in PassMark - Single thread mark: 978 vs 742
Around 20% better performance in PassMark - CPU mark: 1020 vs 849

Specifications (specs)
Manufacturing process technology	22 nm vs 28 nm
Benchmarks
PassMark - Single thread mark	978 vs 742
PassMark - CPU mark	1020 vs 849

Compare benchmarks

CPU 1: AMD A4-9120e
CPU 2: Intel Celeron G1820TE

PassMark - Single thread mark

CPU 1

CPU 2

742

978

PassMark - CPU mark

CPU 1

CPU 2

849

1020

Name	AMD A4-9120e	Intel Celeron G1820TE
PassMark - Single thread mark	742	978
PassMark - CPU mark	849	1020
3DMark Fire Strike - Physics Score		882

Compare specifications (specs)

	AMD A4-9120e	Intel Celeron G1820TE
Essentials
Architecture codename	Stoney Ridge	Haswell
Place in performance rating	2640	2611
Processor Number	A4-9120e	G1820TE
Vertical segment	Mobile	Embedded
Launch date		December 2013
Series		Intel® Celeron® Processor G Series
Status		Launched
Performance
Base frequency	1.5 GHz	2.20 GHz
L1 cache	160 KB	64 KB (per core)
L2 cache	1 MB	256 KB (per core)
Manufacturing process technology	28 nm	22 nm
Maximum frequency	2.2 GHz	2.2 GHz
Number of cores	2	2
Number of threads	2	2
64 bit support
Bus Speed		5 GT/s DMI2
Die size		177 mm
L3 cache		3072 KB (shared)
Maximum case temperature (TCase)		72 °C
Transistor count		1400 million
Memory
Max memory channels	1	2
Maximum memory bandwidth	17.1 GB/s	21.3 GB/s
Supported memory types	DDR4-2133	DDR3 1333
ECC memory support
Maximum memory size		32 GB
Graphics
Number of pipelines	128
Processor graphics	Radeon R3 series	Intel HD Graphics
Graphics base frequency		350 MHz
Graphics max dynamic frequency		1.00 GHz
Graphics max frequency		1 GHz
Intel® Flexible Display Interface (Intel® FDI)
Intel® Quick Sync Video
Max video memory		1.7 GB
Compatibility
Sockets supported	FT4	FCLGA1150
Low Halogen Options Available
Max number of CPUs in a configuration		1
Package Size		37.5mm x 37.5mm
Thermal Design Power (TDP)		35 Watt
Thermal Solution		PCG 2013A
Advanced Technologies
Enhanced Virus Protection (EVP)
Fused Multiply-Add 3 (FMA3)
Fused Multiply-Add 4 (FMA4)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported		3
VGA
Peripherals
Max number of PCIe lanes		16
PCI Express revision		Up to 3.0
PCIe configurations		Up to 1x16, 2x8, 1x8/2x4
Scalability		1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)