AMD E2-9000e vs Intel Celeron G1820TE
Comparative analysis of AMD E2-9000e and Intel Celeron G1820TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Advanced Technologies, Virtualization, Graphics interfaces, Security & Reliability. Benchmark processor performance analysis: GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps), PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the AMD E2-9000e
- Around 90809% higher clock speed: 2000 MHz vs 2.2 GHz
- Around 25% more L1 cache; more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 5.8x lower typical power consumption: 6 Watt vs 35 Watt
Maximum frequency | 2000 MHz vs 2.2 GHz |
L1 cache | 160 KB vs 64 KB (per core) |
L2 cache | 1024 KB vs 256 KB (per core) |
Thermal Design Power (TDP) | 6 Watt vs 35 Watt |
Reasons to consider the Intel Celeron G1820TE
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 28 nm
Manufacturing process technology | 22 nm vs 28 nm |
Compare benchmarks
CPU 1: AMD E2-9000e
CPU 2: Intel Celeron G1820TE
Name | AMD E2-9000e | Intel Celeron G1820TE |
---|---|---|
GFXBench 4.0 - Car Chase Offscreen (Frames) | 319 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 319 | |
GFXBench 4.0 - Manhattan (Frames) | 647 | |
GFXBench 4.0 - Manhattan (Fps) | 647 | |
GFXBench 4.0 - T-Rex (Frames) | 1406 | |
GFXBench 4.0 - T-Rex (Fps) | 1406 | |
PassMark - Single thread mark | 978 | |
PassMark - CPU mark | 1020 | |
3DMark Fire Strike - Physics Score | 882 |
Compare specifications (specs)
AMD E2-9000e | Intel Celeron G1820TE | |
---|---|---|
Essentials |
||
Architecture codename | Stoney Ridge | Haswell |
Family | AMD E2-Series for Notebooks | |
Place in performance rating | 2643 | 2604 |
Vertical segment | Mobile | Embedded |
Launch date | December 2013 | |
Processor Number | G1820TE | |
Series | Intel® Celeron® Processor G Series | |
Status | Launched | |
Performance |
||
64 bit support | ||
Base frequency | 1500 MHz | 2.20 GHz |
L1 cache | 160 KB | 64 KB (per core) |
L2 cache | 1024 KB | 256 KB (per core) |
Manufacturing process technology | 28 nm | 22 nm |
Maximum frequency | 2000 MHz | 2.2 GHz |
Number of cores | 2 | 2 |
Number of threads | 2 | 2 |
Transistor count | 1.2 billion | 1400 million |
Bus Speed | 5 GT/s DMI2 | |
Die size | 177 mm | |
L3 cache | 3072 KB (shared) | |
Maximum case temperature (TCase) | 72 °C | |
Memory |
||
Max memory channels | 1 | 2 |
Maximum memory bandwidth | 14.9 GB/s | 21.3 GB/s |
Supported memory types | DDR4-1866 | DDR3 1333 |
ECC memory support | ||
Maximum memory size | 32 GB | |
Graphics |
||
Graphics base frequency | 600 MHz | 350 MHz |
Number of pipelines | 128 | |
Processor graphics | Radeon R2 series | Intel HD Graphics |
Unified Video Decoder (UVD) | ||
Video Codec Engine (VCE) | ||
Graphics max dynamic frequency | 1.00 GHz | |
Graphics max frequency | 1 GHz | |
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® Quick Sync Video | ||
Max video memory | 1.7 GB | |
Compatibility |
||
Package Size | micro-BGA | 37.5mm x 37.5mm |
Sockets supported | BGA (FT4) | FCLGA1150 |
Thermal Design Power (TDP) | 6 Watt | 35 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Thermal Solution | PCG 2013A | |
Peripherals |
||
PCI Express revision | 3.0 | Up to 3.0 |
Max number of PCIe lanes | 16 | |
PCIe configurations | Up to 1x16, 2x8, 1x8/2x4 | |
Scalability | 1S Only | |
Advanced Technologies |
||
Enhanced Virus Protection (EVP) | ||
Fused Multiply-Add 3 (FMA3) | ||
Fused Multiply-Add 4 (FMA4) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
||
AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics interfaces |
||
DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
VGA | ||
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) |