Intel Celeron G1820TE vs Intel Core i3-2310E
Comparative analysis of Intel Celeron G1820TE and Intel Core i3-2310E processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the Intel Celeron G1820TE
- CPU is newer: launch date 2 year(s) 9 month(s) later
- Around 5% higher clock speed: 2.2 GHz vs 2.1 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- Around 93% higher maximum memory size: 32 GB vs 16.6 GB
- Around 33% better performance in PassMark - Single thread mark: 978 vs 733
Specifications (specs) | |
Launch date | December 2013 vs February 2011 |
Maximum frequency | 2.2 GHz vs 2.1 GHz |
Manufacturing process technology | 22 nm vs 32 nm |
Maximum memory size | 32 GB vs 16.6 GB |
Benchmarks | |
PassMark - Single thread mark | 978 vs 733 |
Reasons to consider the Intel Core i3-2310E
- 2 more threads: 4 vs 2
- Around 81% better performance in PassMark - CPU mark: 1845 vs 1020
Specifications (specs) | |
Number of threads | 4 vs 2 |
Benchmarks | |
PassMark - CPU mark | 1845 vs 1020 |
Compare benchmarks
CPU 1: Intel Celeron G1820TE
CPU 2: Intel Core i3-2310E
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Celeron G1820TE | Intel Core i3-2310E |
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PassMark - Single thread mark | 978 | 733 |
PassMark - CPU mark | 1020 | 1845 |
3DMark Fire Strike - Physics Score | 882 |
Compare specifications (specs)
Intel Celeron G1820TE | Intel Core i3-2310E | |
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Essentials |
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Architecture codename | Haswell | Sandy Bridge |
Launch date | December 2013 | February 2011 |
Place in performance rating | 2605 | 2607 |
Processor Number | G1820TE | i3-2310E |
Series | Intel® Celeron® Processor G Series | Legacy Intel® Core™ Processors |
Status | Launched | Launched |
Vertical segment | Embedded | Embedded |
Launch price (MSRP) | $225 | |
Price now | $225 | |
Value for money (0-100) | 3.72 | |
Performance |
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64 bit support | ||
Base frequency | 2.20 GHz | 2.10 GHz |
Bus Speed | 5 GT/s DMI2 | |
Die size | 177 mm | 149 mm |
L1 cache | 64 KB (per core) | 64 KB (per core) |
L2 cache | 256 KB (per core) | 256 KB (per core) |
L3 cache | 3072 KB (shared) | 3072 KB (shared) |
Manufacturing process technology | 22 nm | 32 nm |
Maximum case temperature (TCase) | 72 °C | |
Maximum frequency | 2.2 GHz | 2.1 GHz |
Number of cores | 2 | 2 |
Number of threads | 2 | 4 |
Transistor count | 1400 million | 624 million |
Maximum core temperature | 100C (BGA) | |
Memory |
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ECC memory support | ||
Max memory channels | 2 | 2 |
Maximum memory bandwidth | 21.3 GB/s | 21.3 GB/s |
Maximum memory size | 32 GB | 16.6 GB |
Supported memory types | DDR3 1333 | DDR3 1066/1333 |
Graphics |
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Graphics base frequency | 350 MHz | 650 MHz |
Graphics max dynamic frequency | 1.00 GHz | 1.05 GHz |
Graphics max frequency | 1 GHz | 1.05 GHz |
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® Quick Sync Video | ||
Max video memory | 1.7 GB | |
Processor graphics | Intel HD Graphics | Intel® HD Graphics 3000 |
Intel® Clear Video HD technology | ||
Intel® InTru™ 3D technology | ||
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | 2 |
VGA | ||
CRT | ||
SDVO | ||
Wireless Display (WiDi) support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | 31mm x 24mm (BGA1023) |
Sockets supported | FCLGA1150 | FCBGA1023 |
Thermal Design Power (TDP) | 35 Watt | 35 Watt |
Thermal Solution | PCG 2013A | |
Peripherals |
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Max number of PCIe lanes | 16 | 16 |
PCI Express revision | Up to 3.0 | 2.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8/2x4 | 1x16, 2x8, 1x8+2x4 |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Anti-Theft technology | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | Intel® AVX |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
4G WiMAX Wireless | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® My WiFi technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |