Intel Core i9-10900KF processor review
Core i9-10900KF processor released by Intel; release date: 30 Apr 2020. At the time of release, the processor cost $463 - $474. The processor is designed for desktop-computers and based on Comet Lake microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 10, threads - 20. Maximum CPU clock speed - 5.30 GHz. Maximum operating temperature - 100°C. Manufacturing process technology - 14 nm. Cache size: L1 - 640 KB, L2 - 2560 KB, L3 - 20 MB.
Supported memory types: DDR4-2933. Maximum memory size: 128 GB.
Supported socket types: FCLGA1200. Maximum number of processors in a configuration - 1. Power consumption (TDP): 125 Watt.
Benchmarks
PassMark Single thread mark |
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PassMark CPU mark |
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3DMark Fire Strike Physics Score |
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Name | Value |
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PassMark - Single thread mark | 3116 |
PassMark - CPU mark | 22511 |
3DMark Fire Strike - Physics Score | 8938 |
Specifications (specs)
Essentials |
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Architecture codename | Comet Lake |
Launch date | 30 Apr 2020 |
Launch price (MSRP) | $463 - $474 |
Place in performance rating | 550 |
Processor Number | i9-10900KF |
Series | 10th Generation Intel Core i9 Processors |
Status | Launched |
Vertical segment | Desktop |
Performance |
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64 bit support | |
Base frequency | 3.70 GHz |
Bus Speed | 8 GT/s |
L1 cache | 640 KB |
L2 cache | 2560 KB |
L3 cache | 20 MB |
Manufacturing process technology | 14 nm |
Maximum core temperature | 100°C |
Maximum frequency | 5.30 GHz |
Number of cores | 10 |
Number of threads | 20 |
Memory |
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Max memory channels | 2 |
Maximum memory bandwidth | 45.8 GB/s |
Maximum memory size | 128 GB |
Supported memory types | DDR4-2933 |
Compatibility |
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Configurable TDP-down | 95 Watt |
Configurable TDP-down Frequency | 3.30 GHz |
Max number of CPUs in a configuration | 1 |
Package Size | 37.5mm x 37.5mm |
Sockets supported | FCLGA1200 |
Thermal Design Power (TDP) | 125 Watt |
Thermal Solution | PCG 2015D |
Peripherals |
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Max number of PCIe lanes | 16 |
PCI Express revision | 3.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 |
Scalability | 1S Only |
Security & Reliability |
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Execute Disable Bit (EDB) | |
Intel® Identity Protection technology | |
Intel® OS Guard | |
Intel® Secure Key technology | |
Intel® Software Guard Extensions (Intel® SGX) | |
Intel® Trusted Execution technology (TXT) | |
Secure Boot | |
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | |
Idle States | |
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 |
Intel 64 | |
Intel® AES New Instructions | |
Intel® Hyper-Threading technology | |
Intel® Optane™ Memory Supported | |
Intel® Stable Image Platform Program (SIPP) | |
Intel® Thermal Velocity Boost | |
Intel® Turbo Boost technology | |
Thermal Monitoring | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | |
Intel® Virtualization Technology for Directed I/O (VT-d) | |
Intel® VT-x with Extended Page Tables (EPT) |