Intel Pentium G860T processor review
Pentium G860T processor released by Intel; release date: June 2012. The processor is designed for desktop-computers and based on Sandy Bridge microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 2.6 GHz. Maximum operating temperature - 65.0°C. Manufacturing process technology - 32 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 3072 KB (shared).
Supported memory types: DDR3 1066/1333. Maximum memory size: 32 GB.
Supported socket types: FCLGA1155. Maximum number of processors in a configuration - 1. Power consumption (TDP): 35 Watt.
The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 1.1 GHz.
Specifications (specs)
Essentials |
|
| Architecture codename | Sandy Bridge |
| Launch date | June 2012 |
| Place in performance rating | not rated |
| Processor Number | G860T |
| Series | Legacy Intel® Pentium® Processor |
| Status | Discontinued |
| Vertical segment | Desktop |
Performance |
|
| 64 bit support | |
| Base frequency | 2.60 GHz |
| Bus Speed | 5 GT/s DMI |
| Die size | 131 mm |
| L1 cache | 64 KB (per core) |
| L2 cache | 256 KB (per core) |
| L3 cache | 3072 KB (shared) |
| Manufacturing process technology | 32 nm |
| Maximum core temperature | 65.0°C |
| Maximum frequency | 2.6 GHz |
| Number of cores | 2 |
| Number of threads | 2 |
| Transistor count | 504 million |
Memory |
|
| Max memory channels | 2 |
| Maximum memory bandwidth | 21 GB/s |
| Maximum memory size | 32 GB |
| Supported memory types | DDR3 1066/1333 |
Graphics |
|
| Graphics base frequency | 650 MHz |
| Graphics max dynamic frequency | 1.10 GHz |
| Graphics max frequency | 1.1 GHz |
| Intel® Clear Video HD technology | |
| Intel® Flexible Display Interface (Intel® FDI) | |
| Intel® InTru™ 3D technology | |
| Intel® Quick Sync Video | |
| Processor graphics | Intel HD Graphics |
Graphics interfaces |
|
| Number of displays supported | 2 |
| Wireless Display (WiDi) support | |
Compatibility |
|
| Low Halogen Options Available | |
| Max number of CPUs in a configuration | 1 |
| Package Size | 37.5 x 37.5 mm |
| Sockets supported | FCLGA1155 |
| Thermal Design Power (TDP) | 35 Watt |
Peripherals |
|
| PCI Express revision | 2.0 |
Security & Reliability |
|
| Execute Disable Bit (EDB) | |
| Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
|
| Enhanced Intel SpeedStep® technology | |
| Flexible Display interface (FDI) | |
| Idle States | |
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 |
| Intel 64 | |
| Intel® Advanced Vector Extensions (AVX) | |
| Intel® AES New Instructions | |
| Intel® Fast Memory Access | |
| Intel® Flex Memory Access | |
| Intel® Hyper-Threading technology | |
| Intel® Optane™ Memory Supported | |
| Intel® Turbo Boost technology | |
| Intel® vPro™ Platform Eligibility | |
| Thermal Monitoring | |
Virtualization |
|
| Intel® Virtualization Technology (VT-x) | |
| Intel® Virtualization Technology for Directed I/O (VT-d) | |
| Intel® VT-x with Extended Page Tables (EPT) | |
