AMD 3015e vs Intel Xeon E5-2608L v3
Comparative analysis of AMD 3015e and Intel Xeon E5-2608L v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD 3015e
- Around 18% higher maximum core temperature: 105 °C vs 88.84°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- 8.7x lower typical power consumption: 6 Watt vs 52 Watt
- Around 11% better performance in PassMark - Single thread mark: 1339 vs 1210
Specifications (specs) | |
Maximum core temperature | 105 °C vs 88.84°C |
Manufacturing process technology | 14 nm vs 22 nm |
Thermal Design Power (TDP) | 6 Watt vs 52 Watt |
Benchmarks | |
PassMark - Single thread mark | 1339 vs 1210 |
Reasons to consider the Intel Xeon E5-2608L v3
- 4 more cores, run more applications at once: 6 vs 2
- 8 more threads: 12 vs 4
- 2.4x better performance in PassMark - CPU mark: 6415 vs 2712
Specifications (specs) | |
Number of cores | 6 vs 2 |
Number of threads | 12 vs 4 |
Benchmarks | |
PassMark - CPU mark | 6415 vs 2712 |
Compare benchmarks
CPU 1: AMD 3015e
CPU 2: Intel Xeon E5-2608L v3
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD 3015e | Intel Xeon E5-2608L v3 |
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PassMark - Single thread mark | 1339 | 1210 |
PassMark - CPU mark | 2712 | 6415 |
Compare specifications (specs)
AMD 3015e | Intel Xeon E5-2608L v3 | |
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Essentials |
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Architecture codename | Zen | Haswell |
Launch date | 6 Jul 2020 | Q3'14 |
OPN Tray | AM3015BRP2OFJ | |
Place in performance rating | 1863 | 1872 |
Vertical segment | Laptop | Embedded |
Processor Number | E5-2608LV3 | |
Series | Intel® Xeon® Processor E5 v3 Family | |
Status | Launched | |
Performance |
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Base frequency | 1.2 GHz | 2.00 GHz |
L2 cache | 1 MB | |
L3 cache | 4 MB | |
Manufacturing process technology | 14 nm | 22 nm |
Maximum core temperature | 105 °C | 88.84°C |
Maximum frequency | 2.3 GHz | |
Number of cores | 2 | 6 |
Number of GPU cores | 3 | |
Number of threads | 4 | 12 |
Unlocked | ||
64 bit support | ||
Bus Speed | 6.4 GT/s QPI | |
Number of QPI Links | 2 | |
VID voltage range | 0.65V–1.30V | |
Memory |
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Max memory channels | 1 | 4 |
Supported memory types | DDR4-1600 | DDR4 1600/1866 |
Maximum memory bandwidth | 59 GB/s | |
Maximum memory size | 768 GB | |
Graphics |
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Graphics base frequency | 600 MHz | |
Processor graphics | Radeon Vega 3 | |
Graphics interfaces |
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DisplayPort | ||
HDMI | ||
Compatibility |
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Sockets supported | FT5 | FCLGA2011-3 |
Thermal Design Power (TDP) | 6 Watt | 52 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 2 | |
Package Size | 52.5mm x 45mm | |
Peripherals |
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PCI Express revision | 3.0 | 3.0 |
Max number of PCIe lanes | 40 | |
PCIe configurations | x4, x8, x16 | |
Scalability | 2S | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 46-bit | |
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |