AMD Athlon PRO 300U vs AMD Ryzen Embedded R1600
Comparative analysis of AMD Athlon PRO 300U and AMD Ryzen Embedded R1600 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Athlon PRO 300U
- Around 6% higher clock speed: 3.3 GHz vs 3.1 GHz
- Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 9% better performance in PassMark - Single thread mark: 1931 vs 1779
- Around 21% better performance in PassMark - CPU mark: 4080 vs 3365
Specifications (specs) | |
Maximum frequency | 3.3 GHz vs 3.1 GHz |
L1 cache | 128K (per core) vs 192 KB |
Benchmarks | |
PassMark - Single thread mark | 1931 vs 1779 |
PassMark - CPU mark | 4080 vs 3365 |
Reasons to consider the AMD Ryzen Embedded R1600
- CPU is newer: launch date 10 month(s) later
- 1048576x more L3 cache, more data can be stored in the L3 cache for quick access later
Launch date | 25 Feb 2020 vs 8 Apr 2019 |
L3 cache | 4 MB vs 4MB (shared) |
Compare benchmarks
CPU 1: AMD Athlon PRO 300U
CPU 2: AMD Ryzen Embedded R1600
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Athlon PRO 300U | AMD Ryzen Embedded R1600 |
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PassMark - Single thread mark | 1931 | 1779 |
PassMark - CPU mark | 4080 | 3365 |
Compare specifications (specs)
AMD Athlon PRO 300U | AMD Ryzen Embedded R1600 | |
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Essentials |
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Architecture codename | Raven Ridge 2 | Zen |
Launch date | 8 Apr 2019 | 25 Feb 2020 |
Place in performance rating | 1322 | 1461 |
Vertical segment | Mobile | |
Performance |
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Base frequency | 2.4 GHz | 2.6 GHz |
L1 cache | 128K (per core) | 192 KB |
L2 cache | 512K (per core) | 1 MB |
L3 cache | 4MB (shared) | 4 MB |
Manufacturing process technology | 14 nm | 14 nm |
Maximum frequency | 3.3 GHz | 3.1 GHz |
Number of cores | 2 | 2 |
Number of threads | 4 | 4 |
Unlocked | ||
Die size | 209.8 mm² | |
Maximum core temperature | 105 °C | |
Transistor count | 4950 million | |
Memory |
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ECC memory support | ||
Supported memory types | DDR4, Dual-channel | DDR4-2400 |
Max memory channels | 2 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | FP5 | |
Thermal Design Power (TDP) | 15 Watt | 15 Watt |
Configurable TDP-down | 12 Watt | |
Configurable TDP-up | 25 Watt | |
Socket Count | FP5 | |
Peripherals |
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Max number of PCIe lanes | 8 | |
PCI Express revision | 3.0 |