AMD E2-9000e vs Intel Core i3-330E

Comparative analysis of AMD E2-9000e and Intel Core i3-330E processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Advanced Technologies, Virtualization, Graphics interfaces, Security & Reliability. Benchmark processor performance analysis: GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps), PassMark - Single thread mark, PassMark - CPU mark.

AMD E2-9000e

Intel Core i3-330E

Differences

Reasons to consider the AMD E2-9000e

A newer manufacturing process allows for a more powerful, yet cooler running processor: 28 nm vs 32 nm
5.8x lower typical power consumption: 6 Watt vs 35 Watt

Manufacturing process technology	28 nm vs 32 nm
Thermal Design Power (TDP)	6 Watt vs 35 Watt

Reasons to consider the Intel Core i3-330E

2 more threads: 4 vs 2

Number of threads	4 vs 2

Compare benchmarks

CPU 1: AMD E2-9000e
CPU 2: Intel Core i3-330E

Name	AMD E2-9000e	Intel Core i3-330E
GFXBench 4.0 - Car Chase Offscreen (Frames)	319
GFXBench 4.0 - Car Chase Offscreen (Fps)	319
GFXBench 4.0 - Manhattan (Frames)	647
GFXBench 4.0 - Manhattan (Fps)	647
GFXBench 4.0 - T-Rex (Frames)	1406
GFXBench 4.0 - T-Rex (Fps)	1406
PassMark - Single thread mark		934
PassMark - CPU mark		1260

Compare specifications (specs)

	AMD E2-9000e	Intel Core i3-330E
Essentials
Architecture codename	Stoney Ridge	Arrandale
Family	AMD E2-Series for Notebooks
Place in performance rating	2643	2353
Vertical segment	Mobile	Mobile
Launch date		Q1'10
Processor Number		i3-330E
Series		Legacy Intel® Core™ Processors
Status		Launched
Performance
64 bit support
Base frequency	1500 MHz	2.13 GHz
L1 cache	160 KB
L2 cache	1024 KB
Manufacturing process technology	28 nm	32 nm
Maximum frequency	2000 MHz
Number of cores	2	2
Number of threads	2	4
Transistor count	1.2 billion	382 million
Bus Speed		2.5 GT/s DMI
Die size		81 mm2
Maximum core temperature		90°C for rPGA,105°C for BGA
Memory
Max memory channels	1	2
Maximum memory bandwidth	14.9 GB/s	17.1 GB/s
Supported memory types	DDR4-1866	DDR3 800/1066
Maximum memory size		8.79 GB
Graphics
Graphics base frequency	600 MHz	500 MHz
Number of pipelines	128
Processor graphics	Radeon R2 series	Intel HD Graphics
Unified Video Decoder (UVD)
Video Codec Engine (VCE)
Graphics max dynamic frequency		667 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Compatibility
Package Size	micro-BGA	BGA 34mmX28mm
Sockets supported	BGA (FT4)	BGA1288
Thermal Design Power (TDP)	6 Watt	35 Watt
Low Halogen Options Available
Max number of CPUs in a configuration		1
Peripherals
PCI Express revision	3.0	2.0
Max number of PCIe lanes		16
PCIe configurations		1X16, 2X8
Advanced Technologies
Enhanced Virus Protection (EVP)
Fused Multiply-Add 3 (FMA3)
Fused Multiply-Add 4 (FMA4)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)		36-bit
Thermal Monitoring
Virtualization
AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Graphics interfaces
Number of displays supported		2
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)