AMD EPYC 7302P vs Intel Xeon E7-8867 v3
Comparative analysis of AMD EPYC 7302P and Intel Xeon E7-8867 v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD EPYC 7302P
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm, 14 nm vs 22 nm
- 2.7x more maximum memory size: 4 TB vs 1.5 TB
- Around 6% lower typical power consumption: 155 Watt vs 165 Watt
- Around 8% better performance in PassMark - Single thread mark: 1877 vs 1730
Specifications (specs) | |
Manufacturing process technology | 7 nm, 14 nm vs 22 nm |
Maximum memory size | 4 TB vs 1.5 TB |
Thermal Design Power (TDP) | 155 Watt vs 165 Watt |
Benchmarks | |
PassMark - Single thread mark | 1877 vs 1730 |
Reasons to consider the Intel Xeon E7-8867 v3
- Around 41% better performance in PassMark - CPU mark: 46001 vs 32626
Benchmarks | |
PassMark - CPU mark | 46001 vs 32626 |
Compare benchmarks
CPU 1: AMD EPYC 7302P
CPU 2: Intel Xeon E7-8867 v3
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD EPYC 7302P | Intel Xeon E7-8867 v3 |
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PassMark - Single thread mark | 1877 | 1730 |
PassMark - CPU mark | 32626 | 46001 |
Compare specifications (specs)
AMD EPYC 7302P | Intel Xeon E7-8867 v3 | |
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Essentials |
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Architecture codename | Zen 2 | Haswell |
Launch date | 7 Aug 2019 | Q2'15 |
Launch price (MSRP) | $825 | |
OPN PIB | 100-100000049WOF | |
OPN Tray | 100-000000049 | |
Place in performance rating | 898 | 772 |
Vertical segment | Server | Server |
Processor Number | E7-8867V3 | |
Series | Intel® Xeon® Processor E7 v3 Family | |
Status | Launched | |
Performance |
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Base frequency | 3.0 GHz | 2.50 GHz |
L1 cache | 1 MB | |
L2 cache | 8 MB | |
L3 cache | 128 MB | |
Manufacturing process technology | 7 nm, 14 nm | 22 nm |
Maximum frequency | 3.3 GHz | 3.30 GHz |
Number of cores | 16 | 16 |
Number of threads | 32 | 32 |
Unlocked | ||
64 bit support | ||
Bus Speed | 9.6 GT/s QPI | |
Maximum core temperature | 79°C | |
Number of QPI Links | 3 | |
Memory |
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ECC memory support | ||
Max memory channels | 8 | 4 |
Maximum memory bandwidth | 190.7 GB/s | 85 GB/s |
Maximum memory size | 4 TB | 1.5 TB |
Supported memory types | DDR4-3200 | DDR4-1333/1600/1866, DDR3-1066/1333/1600 |
Compatibility |
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Socket Count | 1P | |
Sockets supported | SP3 | FCLGA2011 |
Thermal Design Power (TDP) | 155 Watt | 165 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 8 | |
Package Size | 52mm x 45mm | |
Peripherals |
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Max number of PCIe lanes | 128 | 32 |
PCI Express revision | 4.0 | 3.0 |
PCIe configurations | x16, x8 | x4, x8, x16 |
Scalability | S8S | |
Advanced Technologies |
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AMD SenseMI | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX2 | |
Intel 64 | ||
Intel® Hyper-Threading technology | ||
Intel® Instruction Replay Technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 46-bit | |
Thermal Monitoring | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) |