AMD EPYC 73F3 vs Intel Pentium M 745

Comparative analysis of AMD EPYC 73F3 and Intel Pentium M 745 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD EPYC 73F3

Intel Pentium M 745

Differences

Reasons to consider the AMD EPYC 73F3

CPU is newer: launch date 16 year(s) 10 month(s) later
15 more cores, run more applications at once: 16 vs 1
31 more threads: 32 vs 1
Around 122% higher clock speed: 4.0 GHz vs 1.8 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm+ vs 90 nm
32x more L1 cache, more data can be stored in the L1 cache for quick access later
4x more L2 cache, more data can be stored in the L2 cache for quick access later

Launch date	15 Mar 2021 vs May 2004
Number of cores	16 vs 1
Number of threads	32 vs 1
Maximum frequency	4.0 GHz vs 1.8 GHz
Manufacturing process technology	7 nm+ vs 90 nm
L1 cache	1 MB vs 32 KB
L2 cache	8 MB vs 2048 KB

Reasons to consider the Intel Pentium M 745

30x lower typical power consumption: 7.5 Watt vs 240 Watt

Thermal Design Power (TDP)	7.5 Watt vs 240 Watt

Compare benchmarks

CPU 1: AMD EPYC 73F3
CPU 2: Intel Pentium M 745

Name	AMD EPYC 73F3	Intel Pentium M 745
PassMark - Single thread mark	2831
PassMark - CPU mark	72363

Compare specifications (specs)

	AMD EPYC 73F3	Intel Pentium M 745
Essentials
Architecture codename	Zen 3	Dothan
Launch date	15 Mar 2021	May 2004
Launch price (MSRP)	$3521
OPN PIB	100-100000321WOF
OPN Tray	100-000000321
Place in performance rating	167	not rated
Vertical segment	Server	Mobile
Processor Number		745
Series		Legacy Intel® Pentium® Processor
Status		Discontinued
Performance
Base frequency	3.5 GHz	1.80 GHz
L1 cache	1 MB	32 KB
L2 cache	8 MB	2048 KB
L3 cache	256 MB
Manufacturing process technology	7 nm+	90 nm
Maximum frequency	4.0 GHz	1.8 GHz
Number of cores	16	1
Number of threads	32	1
Unlocked
64 bit support
Bus Speed		400 MHz FSB
Die size		87 mm2
Front-side bus (FSB)		400 MHz
Maximum core temperature		100°C
Transistor count		144 million
VID voltage range		1.276V-1.34V
Memory
ECC memory support
Max memory channels	8
Maximum memory bandwidth	190.73 GB/s
Maximum memory size	4 TB
Supported memory types	DDR4-3200
Compatibility
Configurable TDP	225-240 Watt
Socket Count	1P/2P
Sockets supported	SP3	PPGA478, H-PBGA479
Thermal Design Power (TDP)	240 Watt	7.5 Watt
Low Halogen Options Available
Max number of CPUs in a configuration		1
Package Size		35mm x 35mm
Scenario Design Power (SDP)		0 W
Peripherals
Max number of PCIe lanes	128
PCI Express revision	4.0
Advanced Technologies
AMD SenseMI
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Virtualization
AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)