AMD EPYC 7663P vs Intel Xeon Platinum 8470Q

Comparative analysis of AMD EPYC 7663P and Intel Xeon Platinum 8470Q processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals.

AMD EPYC 7663P

Intel Xeon Platinum 8470Q

Differences

Reasons to consider the AMD EPYC 7663P

CPU is newer: launch date 7 month(s) later
4 more cores, run more applications at once: 56 vs 52
8 more threads: 112 vs 104
A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 10 nm
2.4x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 46% lower typical power consumption: 240 Watt vs 350 Watt

Launch date	5 Sep 2023 vs 10 Jan 2023
Number of cores	56 vs 52
Number of threads	112 vs 104
Manufacturing process technology	7 nm vs 10 nm
L3 cache	256 MB (shared) vs 105 MB
Thermal Design Power (TDP)	240 Watt vs 350 Watt

Reasons to consider the Intel Xeon Platinum 8470Q

Around 9% higher clock speed: 3.8 GHz vs 3.5 GHz
Around 16% more L1 cache; more data can be stored in the L1 cache for quick access later
3.7x more L2 cache, more data can be stored in the L2 cache for quick access later

Maximum frequency	3.8 GHz vs 3.5 GHz
L1 cache	80 KB (per core) vs 64 KB (per core)
L2 cache	2 MB (per core) vs 512 KB (per core)
Max number of CPUs in a configuration	2 vs 1

Compare specifications (specs)

	AMD EPYC 7663P	Intel Xeon Platinum 8470Q
Essentials
Launch date	5 Sep 2023	10 Jan 2023
Launch price (MSRP)	$3139	$9410
Place in performance rating	not rated	not rated
Performance
Base frequency	2000 MHz	2.1 GHz
Die size	8x 81 mm²	4x 477 mm²
L1 cache	64 KB (per core)	80 KB (per core)
L2 cache	512 KB (per core)	2 MB (per core)
L3 cache	256 MB (shared)	105 MB
Manufacturing process technology	7 nm	10 nm
Maximum frequency	3.5 GHz	3.8 GHz
Number of cores	56	52
Number of threads	112	104
Transistor count	33,200 million
Unlocked
Maximum case temperature (TCase)		57°C
Memory
ECC memory support
Supported memory types	DDR4	DDR5
Compatibility
Configurable TDP	225-280 Watt
Max number of CPUs in a configuration	1	2
Sockets supported	SP3	4677
Thermal Design Power (TDP)	240 Watt	350 Watt
Peripherals
PCIe configurations	Gen 4, 128 Lanes, (CPU only)	Gen 5, 80 Lanes, (CPU only)