AMD EPYC 8024P vs Intel Xeon E7-8867 v3

Comparative analysis of AMD EPYC 8024P and Intel Xeon E7-8867 v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD EPYC 8024P

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 22 nm
  • Around 83% lower typical power consumption: 90 Watt vs 165 Watt
  • Around 37% better performance in PassMark - Single thread mark: 2371 vs 1730
Specifications (specs)
Manufacturing process technology 5 nm vs 22 nm
Thermal Design Power (TDP) 90 Watt vs 165 Watt
Benchmarks
PassMark - Single thread mark 2371 vs 1730

Reasons to consider the Intel Xeon E7-8867 v3

  • 8 more cores, run more applications at once: 16 vs 8
  • 16 more threads: 32 vs 16
  • Around 10% higher clock speed: 3.30 GHz vs 3 GHz
  • 2.2x better performance in PassMark - CPU mark: 46001 vs 20556
Specifications (specs)
Number of cores 16 vs 8
Number of threads 32 vs 16
Maximum frequency 3.30 GHz vs 3 GHz
Max number of CPUs in a configuration 8 vs 1
Benchmarks
PassMark - CPU mark 46001 vs 20556

Compare benchmarks

CPU 1: AMD EPYC 8024P
CPU 2: Intel Xeon E7-8867 v3

PassMark - Single thread mark
CPU 1
CPU 2
2371
1730
PassMark - CPU mark
CPU 1
CPU 2
20556
46001
Name AMD EPYC 8024P Intel Xeon E7-8867 v3
PassMark - Single thread mark 2371 1730
PassMark - CPU mark 20556 46001

Compare specifications (specs)

AMD EPYC 8024P Intel Xeon E7-8867 v3

Essentials

Launch date 18 Sep 2023 Q2'15
Launch price (MSRP) $409
Place in performance rating 839 771
Architecture codename Haswell
Processor Number E7-8867V3
Series Intel® Xeon® Processor E7 v3 Family
Status Launched
Vertical segment Server

Performance

Base frequency 2.4 GHz 2.50 GHz
Die size 73 mm²
L1 cache 64 KB (per core)
L2 cache 1 MB (per core)
L3 cache 32 MB (shared)
Manufacturing process technology 5 nm 22 nm
Maximum case temperature (TCase) 75°C
Maximum frequency 3 GHz 3.30 GHz
Number of cores 8 16
Number of threads 16 32
Transistor count 8,875 million
Unlocked
64 bit support
Bus Speed 9.6 GT/s QPI
Maximum core temperature 79°C
Number of QPI Links 3

Memory

ECC memory support
Supported memory types DDR5 DDR4-1333/1600/1866, DDR3-1066/1333/1600
Max memory channels 4
Maximum memory bandwidth 85 GB/s
Maximum memory size 1.5 TB

Compatibility

Configurable TDP 70-100 Watt
Max number of CPUs in a configuration 1 8
Sockets supported SP6 FCLGA2011
Thermal Design Power (TDP) 90 Watt 165 Watt
Low Halogen Options Available
Package Size 52mm x 45mm

Peripherals

PCIe configurations Gen 5, 96 Lanes, (CPU only) x4, x8, x16
Max number of PCIe lanes 32
PCI Express revision 3.0
Scalability S8S

Security & Reliability

Execute Disable Bit (EDB)
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Instruction Replay Technology
Intel® TSX-NI
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 46-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)