AMD EPYC 8024P vs Intel Xeon Gold 6137
Comparative analysis of AMD EPYC 8024P and Intel Xeon Gold 6137 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD EPYC 8024P
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 14 nm
- Around 28% more L3 cache; more data can be stored in the L3 cache for quick access later
- 2.3x lower typical power consumption: 90 Watt vs 205 Watt
- Around 6% better performance in PassMark - CPU mark: 20556 vs 19365
Specifications (specs) | |
Manufacturing process technology | 5 nm vs 14 nm |
L3 cache | 32 MB (shared) vs 25 MB |
Thermal Design Power (TDP) | 90 Watt vs 205 Watt |
Benchmarks | |
PassMark - CPU mark | 20556 vs 19365 |
Reasons to consider the Intel Xeon Gold 6137
- Around 37% higher clock speed: 4.10 GHz vs 3 GHz
- Around 5% better performance in PassMark - Single thread mark: 2499 vs 2371
Specifications (specs) | |
Maximum frequency | 4.10 GHz vs 3 GHz |
Benchmarks | |
PassMark - Single thread mark | 2499 vs 2371 |
Compare benchmarks
CPU 1: AMD EPYC 8024P
CPU 2: Intel Xeon Gold 6137
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD EPYC 8024P | Intel Xeon Gold 6137 |
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PassMark - Single thread mark | 2371 | 2499 |
PassMark - CPU mark | 20556 | 19365 |
Compare specifications (specs)
AMD EPYC 8024P | Intel Xeon Gold 6137 | |
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Essentials |
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Launch date | 18 Sep 2023 | Q3'17 |
Launch price (MSRP) | $409 | |
Place in performance rating | 839 | 801 |
Architecture codename | Skylake | |
Processor Number | 6137 | |
Series | Intel Xeon Scalable Processors | |
Status | Launched | |
Vertical segment | Server | |
Performance |
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Base frequency | 2.4 GHz | 3.90 GHz |
Die size | 73 mm² | |
L1 cache | 64 KB (per core) | |
L2 cache | 1 MB (per core) | |
L3 cache | 32 MB (shared) | 25 MB |
Manufacturing process technology | 5 nm | 14 nm |
Maximum case temperature (TCase) | 75°C | |
Maximum frequency | 3 GHz | 4.10 GHz |
Number of cores | 8 | 8 |
Number of threads | 16 | 16 |
Transistor count | 8,875 million | |
Unlocked | ||
Number of Ultra Path Interconnect (UPI) Links | 3 | |
Memory |
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ECC memory support | ||
Supported memory types | DDR5 | DDR4-2666 |
Max memory channels | 6 | |
Maximum memory size | 768 GB | |
Supported memory frequency | 2666 MHz | |
Compatibility |
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Configurable TDP | 70-100 Watt | |
Max number of CPUs in a configuration | 1 | |
Sockets supported | SP6 | FCLGA3647 |
Thermal Design Power (TDP) | 90 Watt | 205 Watt |
Package Size | 76.0mm x 56.5mm | |
Peripherals |
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PCIe configurations | Gen 5, 96 Lanes, (CPU only) | |
Max number of PCIe lanes | 48 | |
PCI Express revision | 3.0 | |
Scalability | S4S | |
Security & Reliability |
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Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Instruction set extensions | Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Number of AVX-512 FMA Units | 2 | |
Speed Shift technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) |