AMD EPYC 8324P vs Intel Xeon Gold 6240R

Comparative analysis of AMD EPYC 8324P and Intel Xeon Gold 6240R processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD EPYC 8324P

  • 8 more cores, run more applications at once: 32 vs 24
  • 16 more threads: 64 vs 48
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 14 nm
  • 3.6x more L3 cache, more data can be stored in the L3 cache for quick access later
  • Around 2% better performance in PassMark - CPU mark: 57127 vs 55974
Specifications (specs)
Number of cores 32 vs 24
Number of threads 64 vs 48
Manufacturing process technology 5 nm vs 14 nm
L3 cache 128 MB (shared) vs 35.75 MB
Benchmarks
PassMark - Single thread mark 2367 vs 2358
PassMark - CPU mark 57127 vs 55974

Reasons to consider the Intel Xeon Gold 6240R

  • Around 33% higher clock speed: 4.00 GHz vs 3 GHz
  • Around 9% lower typical power consumption: 165 Watt vs 180 Watt
Maximum frequency 4.00 GHz vs 3 GHz
Thermal Design Power (TDP) 165 Watt vs 180 Watt

Compare benchmarks

CPU 1: AMD EPYC 8324P
CPU 2: Intel Xeon Gold 6240R

PassMark - Single thread mark
CPU 1
CPU 2
2367
2358
PassMark - CPU mark
CPU 1
CPU 2
57127
55974
Name AMD EPYC 8324P Intel Xeon Gold 6240R
PassMark - Single thread mark 2367 2358
PassMark - CPU mark 57127 55974

Compare specifications (specs)

AMD EPYC 8324P Intel Xeon Gold 6240R

Essentials

Launch date 18 Sep 2023 Q1'20
Launch price (MSRP) $1895 $2594
Place in performance rating 351 362
Architecture codename Cascade Lake
Processor Number 6240R
Series 2nd Generation Intel Xeon Scalable Processors
Vertical segment Server

Performance

Base frequency 2.65 GHz 2.40 GHz
Die size 4x 73 mm²
L1 cache 64 KB (per core)
L2 cache 1 MB (per core)
L3 cache 128 MB (shared) 35.75 MB
Manufacturing process technology 5 nm 14 nm
Maximum case temperature (TCase) 75°C
Maximum frequency 3 GHz 4.00 GHz
Number of cores 32 24
Number of threads 64 48
Transistor count 35,500 million
Unlocked
Maximum core temperature 90°C

Memory

ECC memory support
Supported memory types DDR5 DDR4-2933
Max memory channels 6
Maximum memory size 1 TB
Supported memory frequency 2933 MHz

Compatibility

Configurable TDP 155-225 Watt
Max number of CPUs in a configuration 1
Sockets supported SP6 FCLGA3647
Thermal Design Power (TDP) 180 Watt 165 Watt
Package Size 76.0mm x 56.5mm

Peripherals

PCIe configurations Gen 5, 96 Lanes, (CPU only)
Max number of PCIe lanes 48
PCI Express revision 3.0
Scalability 2S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Instruction set extensions Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Number of AVX-512 FMA Units 2
Speed Shift technology

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)