AMD EPYC 9965 vs Intel Xeon Platinum 8170

Comparative analysis of AMD EPYC 9965 and Intel Xeon Platinum 8170 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD EPYC 9965

Intel Xeon Platinum 8170

Differences

Reasons to consider the AMD EPYC 9965

166 more cores, run more applications at once: 192 vs 26
332 more threads: 384 vs 52
A newer manufacturing process allows for a more powerful, yet cooler running processor: 3 nm vs 14 nm

Number of cores	192 vs 26
Number of threads	384 vs 52
Manufacturing process technology	3 nm vs 14 nm

Reasons to consider the Intel Xeon Platinum 8170

3x lower typical power consumption: 165 Watt vs 500 Watt

Thermal Design Power (TDP)	165 Watt vs 500 Watt

Compare benchmarks

CPU 1: AMD EPYC 9965
CPU 2: Intel Xeon Platinum 8170

Name	AMD EPYC 9965	Intel Xeon Platinum 8170
PassMark - Single thread mark	3190
PassMark - CPU mark	185062
Geekbench 4 - Single Core		4221
Geekbench 4 - Multi-Core		33793

Compare specifications (specs)

	AMD EPYC 9965	Intel Xeon Platinum 8170
Essentials
Launch date	10 Oct 2024	Q3'17
Launch price (MSRP)	$14813
Place in performance rating	3	1
Architecture codename		Skylake
Processor Number		8170
Series		Intel® Xeon® Scalable Processors
Status		Launched
Vertical segment		Server
Performance
Base frequency	2.25 GHz	2.10 GHz
L1 cache	80 KB (per core)
L2 cache	1 MB (per core)
L3 cache	384 MB (shared)
Manufacturing process technology	3 nm	14 nm
Maximum frequency	3.7 GHz	3.70 GHz
Number of cores	192	26
Number of threads	384	52
Unlocked
Maximum core temperature		89°C
Number of Ultra Path Interconnect (UPI) Links		3
Memory
ECC memory support
Supported memory types	DDR5	DDR4-2666
Max memory channels		6
Maximum memory size		768 GB
Supported memory frequency		2666 MHz
Compatibility
Configurable TDP	450-500 Watt
Max number of CPUs in a configuration	2
Sockets supported	SP5	FCLGA3647
Thermal Design Power (TDP)	500 Watt	165 Watt
Low Halogen Options Available
Package Size		76.0mm x 56.5mm
Peripherals
PCIe configurations	Gen 5, 128 Lanes, (CPU only)
Max number of PCIe lanes		48
PCI Express revision		3.0
Scalability		S8S
Security & Reliability
Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Instruction set extensions		Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units		2
Speed Shift technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)