AMD Opteron 2350 HE vs Intel Pentium III 1400S

Comparative analysis of AMD Opteron 2350 HE and Intel Pentium III 1400S processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Opteron 2350 HE

Intel Pentium III 1400S

Differences

Reasons to consider the AMD Opteron 2350 HE

CPU is newer: launch date 6 year(s) 8 month(s) later
3 more cores, run more applications at once: 4 vs 1
Around 43% higher clock speed: 2 GHz vs 1.4 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 130 nm
32x more L1 cache, more data can be stored in the L1 cache for quick access later
4x more L2 cache, more data can be stored in the L2 cache for quick access later
14.5x better performance in PassMark - CPU mark: 2820 vs 194

Specifications (specs)
Launch date	October 2008 vs January 2002
Number of cores	4 vs 1
Maximum frequency	2 GHz vs 1.4 GHz
Manufacturing process technology	65 nm vs 130 nm
L1 cache	256 KB (shared) vs 8 KB
L2 cache	2048 KB (shared) vs 512 KB
Benchmarks
PassMark - CPU mark	2820 vs 194

Reasons to consider the Intel Pentium III 1400S

2.5x lower typical power consumption: 32.2 Watt vs 79 Watt

Thermal Design Power (TDP)	32.2 Watt vs 79 Watt

Compare benchmarks

CPU 1: AMD Opteron 2350 HE
CPU 2: Intel Pentium III 1400S

PassMark - CPU mark

CPU 1

CPU 2

2820

194

Name	AMD Opteron 2350 HE	Intel Pentium III 1400S
PassMark - Single thread mark	0	278
PassMark - CPU mark	2820	194

Compare specifications (specs)

	AMD Opteron 2350 HE	Intel Pentium III 1400S
Essentials
Architecture codename	Barcelona	Tualatin
Launch date	October 2008	January 2002
Place in performance rating	3317	3255
Vertical segment	Server	Server
Series		Legacy Intel® Pentium® Processor
Status		Discontinued
Performance
64 bit support
Die size	285 mm	80 mm
L1 cache	256 KB (shared)	8 KB
L2 cache	2048 KB (shared)	512 KB
L3 cache	2048 KB
Manufacturing process technology	65 nm	130 nm
Maximum case temperature (TCase)	76 °C	69 °C
Maximum frequency	2 GHz	1.4 GHz
Number of cores	4	1
Transistor count	463 million	44 million
Base frequency		1.40 GHz
Bus Speed		133 MHz FSB
Maximum core temperature		69°C
VID voltage range		1.5V
Compatibility
Sockets supported	Fr2	PPGA370
Thermal Design Power (TDP)	79 Watt	32.2 Watt
Low Halogen Options Available
Max number of CPUs in a configuration		1
Advanced Technologies
Intel® Turbo Boost technology
Virtualization
Intel® Virtualization Technology (VT-x)