AMD Opteron 2350 HE vs Intel Xeon 3.06

Comparative analysis of AMD Opteron 2350 HE and Intel Xeon 3.06 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Opteron 2350 HE

Intel Xeon 3.06

Differences

Reasons to consider the AMD Opteron 2350 HE

CPU is newer: launch date 5 year(s) 3 month(s) later
3 more cores, run more applications at once: 4 vs 1
A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 130 nm
32x more L1 cache, more data can be stored in the L1 cache for quick access later
4x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 23% lower typical power consumption: 79 Watt vs 97 Watt
5.7x better performance in PassMark - CPU mark: 2820 vs 491

Specifications (specs)
Launch date	October 2008 vs July 2003
Number of cores	4 vs 1
Manufacturing process technology	65 nm vs 130 nm
L1 cache	256 KB (shared) vs 8 KB
L2 cache	2048 KB (shared) vs 512 KB
Thermal Design Power (TDP)	79 Watt vs 97 Watt
Benchmarks
PassMark - CPU mark	2820 vs 491

Reasons to consider the Intel Xeon 3.06

Around 54% higher clock speed: 3.07 GHz vs 2 GHz

Maximum frequency	3.07 GHz vs 2 GHz

Compare benchmarks

CPU 1: AMD Opteron 2350 HE
CPU 2: Intel Xeon 3.06

PassMark - CPU mark

CPU 1

CPU 2

2820

491

Name	AMD Opteron 2350 HE	Intel Xeon 3.06
PassMark - Single thread mark	0	0
PassMark - CPU mark	2820	491

Compare specifications (specs)

	AMD Opteron 2350 HE	Intel Xeon 3.06
Essentials
Architecture codename	Barcelona	Gallatin
Launch date	October 2008	July 2003
Place in performance rating	3235	3250
Vertical segment	Server	Server
Performance
64 bit support
Die size	285 mm	237 mm
L1 cache	256 KB (shared)	8 KB
L2 cache	2048 KB (shared)	512 KB
L3 cache	2048 KB	2048 KB
Manufacturing process technology	65 nm	130 nm
Maximum case temperature (TCase)	76 °C
Maximum frequency	2 GHz	3.07 GHz
Number of cores	4	1
Transistor count	463 million	286 million
Compatibility
Sockets supported	Fr2	604
Thermal Design Power (TDP)	79 Watt	97 Watt
Max number of CPUs in a configuration		2