AMD Opteron 2350 HE vs Intel Pentium III 1266S
Comparative analysis of AMD Opteron 2350 HE and Intel Pentium III 1266S processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Opteron 2350 HE
- 3 more cores, run more applications at once: 4 vs 1
- Around 57% higher clock speed: 2 GHz vs 1.27 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 130 nm
- 32x more L1 cache, more data can be stored in the L1 cache for quick access later
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- 9.1x better performance in PassMark - CPU mark: 2820 vs 309
Specifications (specs) | |
Number of cores | 4 vs 1 |
Maximum frequency | 2 GHz vs 1.27 GHz |
Manufacturing process technology | 65 nm vs 130 nm |
L1 cache | 256 KB (shared) vs 8 KB |
L2 cache | 2048 KB (shared) vs 512 KB |
Benchmarks | |
PassMark - CPU mark | 2820 vs 309 |
Reasons to consider the Intel Pentium III 1266S
- 2.6x lower typical power consumption: 30.4 Watt vs 79 Watt
Thermal Design Power (TDP) | 30.4 Watt vs 79 Watt |
Compare benchmarks
CPU 1: AMD Opteron 2350 HE
CPU 2: Intel Pentium III 1266S
PassMark - CPU mark |
|
|
Name | AMD Opteron 2350 HE | Intel Pentium III 1266S |
---|---|---|
PassMark - Single thread mark | 0 | 0 |
PassMark - CPU mark | 2820 | 309 |
Compare specifications (specs)
AMD Opteron 2350 HE | Intel Pentium III 1266S | |
---|---|---|
Essentials |
||
Architecture codename | Barcelona | Tualatin |
Launch date | October 2008 | Q4'01 |
Place in performance rating | 3317 | 3355 |
Vertical segment | Server | Server |
Series | Legacy Intel® Pentium® Processor | |
Status | Discontinued | |
Performance |
||
64 bit support | ||
Die size | 285 mm | 80 mm |
L1 cache | 256 KB (shared) | 8 KB |
L2 cache | 2048 KB (shared) | 512 KB |
L3 cache | 2048 KB | |
Manufacturing process technology | 65 nm | 130 nm |
Maximum case temperature (TCase) | 76 °C | 69 °C |
Maximum frequency | 2 GHz | 1.27 GHz |
Number of cores | 4 | 1 |
Transistor count | 463 million | 44 million |
Base frequency | 1.26 GHz | |
Bus Speed | 133 MHz FSB | |
Maximum core temperature | 69°C | |
VID voltage range | 1.5V | |
Compatibility |
||
Sockets supported | Fr2 | PPGA370 |
Thermal Design Power (TDP) | 79 Watt | 30.4 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Advanced Technologies |
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Intel® Turbo Boost technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) |