AMD Opteron 252 vs Intel Pentium III 1266S

Comparative analysis of AMD Opteron 252 and Intel Pentium III 1266S processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Opteron 252

Intel Pentium III 1266S

Differences

Reasons to consider the AMD Opteron 252

Around 105% higher clock speed: 2.6 GHz vs 1.27 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 90 nm vs 130 nm
16x more L1 cache, more data can be stored in the L1 cache for quick access later
2x more L2 cache, more data can be stored in the L2 cache for quick access later
2.5x better performance in PassMark - CPU mark: 760 vs 309

Specifications (specs)
Maximum frequency	2.6 GHz vs 1.27 GHz
Manufacturing process technology	90 nm vs 130 nm
L1 cache	128 KB vs 8 KB
L2 cache	1024 KB vs 512 KB
Max number of CPUs in a configuration	2 vs 1
Benchmarks
PassMark - CPU mark	760 vs 309

Reasons to consider the Intel Pentium III 1266S

3.1x lower typical power consumption: 30.4 Watt vs 92 Watt

Thermal Design Power (TDP)	30.4 Watt vs 92 Watt

Compare benchmarks

CPU 1: AMD Opteron 252
CPU 2: Intel Pentium III 1266S

PassMark - CPU mark

CPU 1

CPU 2

760

309

Name	AMD Opteron 252	Intel Pentium III 1266S
PassMark - Single thread mark	0	0
PassMark - CPU mark	760	309

Compare specifications (specs)

	AMD Opteron 252	Intel Pentium III 1266S
Essentials
Architecture codename	Troy	Tualatin
Launch date	February 2005	Q4'01
Launch price (MSRP)	$63
Place in performance rating	3245	3272
Price now	$63.36
Value for money (0-100)	3.54
Vertical segment	Server	Server
Series		Legacy Intel® Pentium® Processor
Status		Discontinued
Performance
64 bit support
L1 cache	128 KB	8 KB
L2 cache	1024 KB	512 KB
Manufacturing process technology	90 nm	130 nm
Maximum frequency	2.6 GHz	1.27 GHz
Number of cores	1	1
Transistor count	106 million	44 million
Base frequency		1.26 GHz
Bus Speed		133 MHz FSB
Die size		80 mm
Maximum case temperature (TCase)		69 °C
Maximum core temperature		69°C
VID voltage range		1.5V
Compatibility
Max number of CPUs in a configuration	2	1
Sockets supported	940	PPGA370
Thermal Design Power (TDP)	92 Watt	30.4 Watt
Low Halogen Options Available
Advanced Technologies
Intel® Turbo Boost technology
Virtualization
Intel® Virtualization Technology (VT-x)