AMD Opteron 252 vs Intel Xeon 3.06
Comparative analysis of AMD Opteron 252 and Intel Xeon 3.06 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Opteron 252
- CPU is newer: launch date 1 year(s) 7 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 90 nm vs 130 nm
- 16x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 5% lower typical power consumption: 92 Watt vs 97 Watt
- Around 55% better performance in PassMark - CPU mark: 760 vs 491
Specifications (specs) | |
Launch date | February 2005 vs July 2003 |
Manufacturing process technology | 90 nm vs 130 nm |
L1 cache | 128 KB vs 8 KB |
L2 cache | 1024 KB vs 512 KB |
Thermal Design Power (TDP) | 92 Watt vs 97 Watt |
Benchmarks | |
PassMark - CPU mark | 760 vs 491 |
Reasons to consider the Intel Xeon 3.06
- Around 18% higher clock speed: 3.07 GHz vs 2.6 GHz
Maximum frequency | 3.07 GHz vs 2.6 GHz |
Compare benchmarks
CPU 1: AMD Opteron 252
CPU 2: Intel Xeon 3.06
PassMark - CPU mark |
|
|
Name | AMD Opteron 252 | Intel Xeon 3.06 |
---|---|---|
PassMark - Single thread mark | 0 | 0 |
PassMark - CPU mark | 760 | 491 |
Compare specifications (specs)
AMD Opteron 252 | Intel Xeon 3.06 | |
---|---|---|
Essentials |
||
Architecture codename | Troy | Gallatin |
Launch date | February 2005 | July 2003 |
Launch price (MSRP) | $63 | |
Place in performance rating | 3245 | 3250 |
Price now | $63.36 | |
Value for money (0-100) | 3.54 | |
Vertical segment | Server | Server |
Performance |
||
64 bit support | ||
L1 cache | 128 KB | 8 KB |
L2 cache | 1024 KB | 512 KB |
Manufacturing process technology | 90 nm | 130 nm |
Maximum frequency | 2.6 GHz | 3.07 GHz |
Number of cores | 1 | 1 |
Transistor count | 106 million | 286 million |
Die size | 237 mm | |
L3 cache | 2048 KB | |
Compatibility |
||
Max number of CPUs in a configuration | 2 | 2 |
Sockets supported | 940 | 604 |
Thermal Design Power (TDP) | 92 Watt | 97 Watt |