AMD Opteron 6212 vs Intel Xeon E3-1230 v3
Comparative analysis of AMD Opteron 6212 and Intel Xeon E3-1230 v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Graphics, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the AMD Opteron 6212
- 4 more cores, run more applications at once: 8 vs 4
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- 8x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
Number of cores | 8 vs 4 |
L1 cache | 384 KB vs 64 KB (per core) |
L2 cache | 8 MB vs 256 KB (per core) |
L3 cache | 16 MB vs 8192 KB (shared) |
Reasons to consider the Intel Xeon E3-1230 v3
- Around 16% higher clock speed: 3.70 GHz vs 3.2 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- Around 44% lower typical power consumption: 80 Watt vs 115 Watt
- Around 92% better performance in PassMark - Single thread mark: 2080 vs 1085
- Around 70% better performance in PassMark - CPU mark: 6817 vs 4007
Specifications (specs) | |
Maximum frequency | 3.70 GHz vs 3.2 GHz |
Manufacturing process technology | 22 nm vs 32 nm |
Thermal Design Power (TDP) | 80 Watt vs 115 Watt |
Benchmarks | |
PassMark - Single thread mark | 2080 vs 1085 |
PassMark - CPU mark | 6817 vs 4007 |
Compare benchmarks
CPU 1: AMD Opteron 6212
CPU 2: Intel Xeon E3-1230 v3
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Opteron 6212 | Intel Xeon E3-1230 v3 |
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PassMark - Single thread mark | 1085 | 2080 |
PassMark - CPU mark | 4007 | 6817 |
Geekbench 4 - Single Core | 865 | |
Geekbench 4 - Multi-Core | 3280 | |
3DMark Fire Strike - Physics Score | 3655 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 4.829 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 83.748 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.585 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.375 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 5.897 |
Compare specifications (specs)
AMD Opteron 6212 | Intel Xeon E3-1230 v3 | |
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Essentials |
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Family | AMD Opteron | |
OPN Tray | OS6212WKT8GGU | |
Place in performance rating | 2093 | 2106 |
Series | AMD Opteron 6200 Series Processor | Intel® Xeon® Processor E3 v3 Family |
Vertical segment | Server | Server |
Architecture codename | Haswell | |
Launch date | June 2013 | |
Launch price (MSRP) | $264 | |
Price now | $261.66 | |
Processor Number | E3-1230 v3 | |
Status | Discontinued | |
Value for money (0-100) | 10.50 | |
Performance |
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Base frequency | 2.6 GHz | 3.30 GHz |
L1 cache | 384 KB | 64 KB (per core) |
L2 cache | 8 MB | 256 KB (per core) |
L3 cache | 16 MB | 8192 KB (shared) |
Manufacturing process technology | 32 nm | 22 nm |
Maximum core temperature | 71.70°C | |
Maximum frequency | 3.2 GHz | 3.70 GHz |
Number of cores | 8 | 4 |
Number of threads | 8 | 8 |
Unlocked | ||
64 bit support | ||
Bus Speed | 5 GT/s DMI | |
Die size | 160 mm | |
Number of QPI Links | 0 | |
Transistor count | 1400 million | |
Memory |
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Supported memory frequency | 2000 MHz | |
Supported memory types | DDR3 | DDR3 and DDR3L 1333/1600 at 1.5V |
ECC memory support | ||
Max memory channels | 2 | |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 32 GB | |
Compatibility |
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Sockets supported | G34 | FCLGA1150 |
Thermal Design Power (TDP) | 115 Watt | 80 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | |
Thermal Solution | PCG 2013D | |
Graphics |
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Processor graphics | None | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | |
PCIe configurations | 1x16, 2x8, 1x8/2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |