AMD Phenom II X3 720 BE vs AMD Sempron 3400+

Comparative analysis of AMD Phenom II X3 720 BE and AMD Sempron 3400+ processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility. Benchmark processor performance analysis: CompuBench 1.5 Desktop - T-Rex (Frames/s), PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Phenom II X3 720 BE

  • CPU is newer: launch date 2 year(s) 9 month(s) later
  • Processor is unlocked, an unlocked multiplier allows for easier overclocking
  • 2 more cores, run more applications at once: 3 vs 1
  • Around 56% higher clock speed: 2.8 GHz vs 1.8 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 90 nm
  • 3x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 6x more L2 cache, more data can be stored in the L2 cache for quick access later
Launch date February 2009 vs May 2006
Unlocked Unlocked vs Locked
Number of cores 3 vs 1
Maximum frequency 2.8 GHz vs 1.8 GHz
Manufacturing process technology 45 nm vs 90 nm
L1 cache 128 KB (per core) vs 128 KB
L2 cache 512 KB (per core) vs 256 KB

Reasons to consider the AMD Sempron 3400+

  • Around 53% lower typical power consumption: 62 Watt vs 95 Watt
Thermal Design Power (TDP) 62 Watt vs 95 Watt

Compare benchmarks

CPU 1: AMD Phenom II X3 720 BE
CPU 2: AMD Sempron 3400+

Name AMD Phenom II X3 720 BE AMD Sempron 3400+
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.161
PassMark - Single thread mark 346
PassMark - CPU mark 292

Compare specifications (specs)

AMD Phenom II X3 720 BE AMD Sempron 3400+

Essentials

Architecture codename Heka Manila
Launch date February 2009 May 2006
Place in performance rating 3211 3207
Vertical segment Desktop Desktop
Launch price (MSRP) $30
Price now $29.91
Value for money (0-100) 4.46

Performance

64 bit support
Die size 258 mm 103 mm
L1 cache 128 KB (per core) 128 KB
L2 cache 512 KB (per core) 256 KB
L3 cache 6144 KB (shared)
Manufacturing process technology 45 nm 90 nm
Maximum frequency 2.8 GHz 1.8 GHz
Number of cores 3 1
Transistor count 758 million 81 million
Unlocked

Memory

Supported memory types DDR3

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported AM3 AM2
Thermal Design Power (TDP) 95 Watt 62 Watt