AMD R-272F vs Intel Core M-5Y51
Comparative analysis of AMD R-272F and Intel Core M-5Y51 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics API support, Compatibility, Peripherals, Advanced Technologies, Virtualization, Graphics image quality, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the AMD R-272F
- Around 23% higher clock speed: 3.2 GHz vs 2.60 GHz
- Around 5% higher maximum core temperature: 100 °C vs 95 °C
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency | 3.2 GHz vs 2.60 GHz |
Maximum core temperature | 100 °C vs 95 °C |
L2 cache | 1 MB vs 512 KB |
Reasons to consider the Intel Core M-5Y51
- CPU is newer: launch date 2 year(s) 6 month(s) later
- 2 more threads: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
- Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
- 7x lower typical power consumption: 4.5 Watt vs 35 Watt
- Around 20% better performance in PassMark - Single thread mark: 1302 vs 1087
- Around 65% better performance in PassMark - CPU mark: 2002 vs 1215
Specifications (specs) | |
Launch date | 1 December 2014 vs 21 May 2012 |
Number of threads | 4 vs 2 |
Manufacturing process technology | 14 nm vs 32 nm |
L1 cache | 128 KB vs 96 KB |
Thermal Design Power (TDP) | 4.5 Watt vs 35 Watt |
Benchmarks | |
PassMark - Single thread mark | 1302 vs 1087 |
PassMark - CPU mark | 2002 vs 1215 |
Compare benchmarks
CPU 1: AMD R-272F
CPU 2: Intel Core M-5Y51
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD R-272F | Intel Core M-5Y51 |
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PassMark - Single thread mark | 1087 | 1302 |
PassMark - CPU mark | 1215 | 2002 |
Geekbench 4 - Single Core | 462 | |
Geekbench 4 - Multi-Core | 830 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 560 | |
GFXBench 4.0 - Manhattan (Frames) | 1304 | |
GFXBench 4.0 - T-Rex (Frames) | 1954 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 560 | |
GFXBench 4.0 - Manhattan (Fps) | 1304 | |
GFXBench 4.0 - T-Rex (Fps) | 1954 |
Compare specifications (specs)
AMD R-272F | Intel Core M-5Y51 | |
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Essentials |
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Architecture codename | Piledriver | Broadwell |
Launch date | 21 May 2012 | 1 December 2014 |
Place in performance rating | 2189 | 2161 |
Vertical segment | Embedded | Mobile |
Processor Number | 5Y51 | |
Series | 5th Generation Intel® Core™ M Processors | |
Status | Launched | |
Performance |
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64 bit support | ||
Base frequency | 2.7 GHz | 1.10 GHz |
L1 cache | 96 KB | 128 KB |
L2 cache | 1 MB | 512 KB |
Manufacturing process technology | 32 nm | 14 nm |
Maximum core temperature | 100 °C | 95 °C |
Maximum frequency | 3.2 GHz | 2.60 GHz |
Number of cores | 2 | 2 |
Number of threads | 2 | 4 |
Die size | 82 mm | |
L3 cache | 4 MB | |
Transistor count | 1300 Million | |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 25.6 GB/s | 25.6 GB/s |
Supported memory types | DDR3-1600, DDR3L-1600, DDR3U-1600 | LPDDR3 1333/1600; DDR3L/DDR3L-RS 1600 |
Maximum memory size | 16 GB | |
Graphics |
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Graphics base frequency | 497 MHz | 300 MHz |
Graphics max frequency | 686 MHz | 900 MHz |
Number of pipelines | 192 | |
Processor graphics | Radeon HD 7520G | Intel® HD Graphics 5300 |
Unified Video Decoder (UVD) | ||
Video Codec Engine (VCE) | ||
Device ID | 0x161E | |
Graphics max dynamic frequency | 900 MHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 16 GB | |
Graphics interfaces |
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DisplayPort | ||
DVI | ||
HDMI | ||
Number of displays supported | 4 | 3 |
VGA | ||
eDP | ||
Wireless Display (WiDi) support | ||
Graphics API support |
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DirectX | 11 | 11.2/12 |
OpenGL | 4.2 | 4.3 |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | FS1 | FCBGA1234 |
Thermal Design Power (TDP) | 35 Watt | 4.5 Watt |
Configurable TDP-down | 3.5 W | |
Configurable TDP-down Frequency | 600 MHz | |
Configurable TDP-up | 6 W | |
Configurable TDP-up Frequency | 1.30 GHz | |
Low Halogen Options Available | ||
Package Size | 30mm x 16.5mm | |
Scenario Design Power (SDP) | 3.5 W | |
Peripherals |
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Max number of PCIe lanes | 16 | 12 |
PCI Express revision | 2.0 | 2.0 |
PCIe configurations | x1 (6), x2 (4), x4 (3) | |
Advanced Technologies |
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Enhanced Virus Protection (EVP) | ||
Fused Multiply-Add 3 (FMA3) | ||
Fused Multiply-Add 4 (FMA4) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Smart Response technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics image quality |
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Max resolution over DisplayPort | 2560x1600@60Hz | |
Max resolution over HDMI 1.4 | 2560x1600@60Hz | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) |