AMD Ryzen 3 PRO 3200GE vs Intel Core i7-4700EQ

Comparative analysis of AMD Ryzen 3 PRO 3200GE and Intel Core i7-4700EQ processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Graphics image quality, Graphics API support, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).

AMD Ryzen 3 PRO 3200GE

Intel Core i7-4700EQ

Differences

Reasons to consider the AMD Ryzen 3 PRO 3200GE

CPU is newer: launch date 6 year(s) 2 month(s) later
Processor is unlocked, an unlocked multiplier allows for easier overclocking
Around 117547% higher clock speed: 4000 MHz vs 3.40 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 12 nm vs 22 nm
Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 34% lower typical power consumption: 35 Watt vs 47 Watt
Around 21% better performance in PassMark - Single thread mark: 2133 vs 1765
Around 24% better performance in PassMark - CPU mark: 6701 vs 5417

Specifications (specs)
Launch date	7 July 2019 vs May 2013
Unlocked	Unlocked vs Locked
Maximum frequency	4000 MHz vs 3.40 GHz
Manufacturing process technology	12 nm vs 22 nm
L1 cache	384 KB vs 64 KB (per core)
L2 cache	2 MB vs 256 KB (per core)
Thermal Design Power (TDP)	35 Watt vs 47 Watt
Benchmarks
PassMark - Single thread mark	2133 vs 1765
PassMark - CPU mark	6701 vs 5417

Reasons to consider the Intel Core i7-4700EQ

4 more threads: 8 vs 4
Around 5% higher maximum core temperature: 100°C vs 95 °C
2x more L3 cache, more data can be stored in the L3 cache for quick access later

Number of threads	8 vs 4
Maximum core temperature	100°C vs 95 °C
L3 cache	8192 KB (shared) vs 4 MB

Compare benchmarks

CPU 1: AMD Ryzen 3 PRO 3200GE
CPU 2: Intel Core i7-4700EQ

PassMark - Single thread mark

CPU 1

CPU 2

2133

1765

PassMark - CPU mark

CPU 1

CPU 2

6701

5417

Name	AMD Ryzen 3 PRO 3200GE	Intel Core i7-4700EQ
PassMark - Single thread mark	2133	1765
PassMark - CPU mark	6701	5417
Geekbench 4 - Single Core		3417
Geekbench 4 - Multi-Core		10338
CompuBench 1.5 Desktop - Face Detection (mPixels/s)		12.089
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)		74.176
CompuBench 1.5 Desktop - T-Rex (Frames/s)		0.456
CompuBench 1.5 Desktop - Video Composition (Frames/s)		3.02
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)		12.937
GFXBench 4.0 - Car Chase Offscreen (Frames)		1086
GFXBench 4.0 - Manhattan (Frames)		2883
GFXBench 4.0 - T-Rex (Frames)		4319
GFXBench 4.0 - Car Chase Offscreen (Fps)		1086
GFXBench 4.0 - Manhattan (Fps)		2883
GFXBench 4.0 - T-Rex (Fps)		4319

Compare specifications (specs)

	AMD Ryzen 3 PRO 3200GE	Intel Core i7-4700EQ
Essentials
Family	Ryzen
Launch date	7 July 2019	May 2013
OPN PIB	YD3200C5FHBOX
OPN Tray	YD3200C5M4MFH
Place in performance rating	1169	1203
Vertical segment	Laptop	Embedded
Architecture codename		Haswell
Processor Number		i7-4700EQ
Series		4th Generation Intel® Core™ i7 Processors
Status		Launched
Performance
64 bit support
Base frequency	3600 MHz	2.40 GHz
L1 cache	384 KB	64 KB (per core)
L2 cache	2 MB	256 KB (per core)
L3 cache	4 MB	8192 KB (shared)
Manufacturing process technology	12 nm	22 nm
Maximum core temperature	95 °C	100°C
Maximum frequency	4000 MHz	3.40 GHz
Number of cores	4	4
Number of GPU cores	8
Number of threads	4	8
Unlocked
Bus Speed		5 GT/s DMI
Die size		177 mm
Maximum case temperature (TCase)		100 °C
Transistor count		1400 million
Memory
Max memory channels	2	2
Supported memory types	DDR4-2933	DDR3L 1333/1600
ECC memory support
Maximum memory bandwidth		25.6 GB/s
Maximum memory size		32 GB
Graphics
Graphics base frequency	1250 MHz	400 MHz
iGPU core count	8
Processor graphics	Radeon Vega 8 Graphics	Intel® HD Graphics 4600
Graphics max dynamic frequency		1.00 GHz
Graphics max frequency		1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory		2 GB
Graphics interfaces
DisplayPort
HDMI
eDP
Number of displays supported		3
VGA
Wireless Display (WiDi) support
Compatibility
Sockets supported	AM4	FCBGA1364
Thermal Design Power (TDP)	35 Watt	47 Watt
Low Halogen Options Available
Max number of CPUs in a configuration		1
Package Size		37.5mm x 32mm x 1.6mm
Peripherals
PCI Express revision	3.0	3.0
Max number of PCIe lanes		16
PCIe configurations		Up to 1x16, 2x8, 1x8 2x4
Scalability		1S Only
Graphics image quality
Max resolution over HDMI 1.4		N / A
Graphics API support
DirectX		11.2/12
OpenGL		4.3
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)