AMD Ryzen 5 3400G vs Intel Core i9-8950HK
Comparative analysis of AMD Ryzen 5 3400G and Intel Core i9-8950HK processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Graphics image quality, Graphics API support, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the AMD Ryzen 5 3400G
- CPU is newer: launch date 1 year(s) 4 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 12 nm vs 14 nm
- Around 33% more L2 cache; more data can be stored in the L2 cache for quick access later
Launch date | 7 July 2019 vs 3 March 2018 |
Manufacturing process technology | 12 nm vs 14 nm |
L2 cache | 2 MB vs 1.5 MB |
Reasons to consider the Intel Core i9-8950HK
- 2 more cores, run more applications at once: 6 vs 4
- 4 more threads: 12 vs 8
- Around 14% higher clock speed: 4.80 GHz vs 4.2 GHz
- Around 5% higher maximum core temperature: 100°C vs 95 °C
- 3x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 44% lower typical power consumption: 45 Watt vs 65 Watt
- Around 5% better performance in PassMark - Single thread mark: 2445 vs 2337
- Around 14% better performance in PassMark - CPU mark: 10562 vs 9280
- Around 19% better performance in Geekbench 4 - Single Core: 1117 vs 939
- Around 41% better performance in Geekbench 4 - Multi-Core: 5166 vs 3657
- 2.3x better performance in 3DMark Fire Strike - Physics Score: 5686 vs 2426
Specifications (specs) | |
Number of cores | 6 vs 4 |
Number of threads | 12 vs 8 |
Maximum frequency | 4.80 GHz vs 4.2 GHz |
Maximum core temperature | 100°C vs 95 °C |
L3 cache | 12 MB vs 4 MB |
Thermal Design Power (TDP) | 45 Watt vs 65 Watt |
Benchmarks | |
PassMark - Single thread mark | 2445 vs 2337 |
PassMark - CPU mark | 10562 vs 9280 |
Geekbench 4 - Single Core | 1117 vs 939 |
Geekbench 4 - Multi-Core | 5166 vs 3657 |
3DMark Fire Strike - Physics Score | 5686 vs 2426 |
Compare benchmarks
CPU 1: AMD Ryzen 5 3400G
CPU 2: Intel Core i9-8950HK
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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3DMark Fire Strike - Physics Score |
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Name | AMD Ryzen 5 3400G | Intel Core i9-8950HK |
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PassMark - Single thread mark | 2337 | 2445 |
PassMark - CPU mark | 9280 | 10562 |
Geekbench 4 - Single Core | 939 | 1117 |
Geekbench 4 - Multi-Core | 3657 | 5166 |
3DMark Fire Strike - Physics Score | 2426 | 5686 |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 7.809 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 65.701 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.914 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 3.409 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 8.455 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 1687 | |
GFXBench 4.0 - Manhattan (Frames) | 812 | |
GFXBench 4.0 - T-Rex (Frames) | 1678 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 1687 | |
GFXBench 4.0 - Manhattan (Fps) | 812 | |
GFXBench 4.0 - T-Rex (Fps) | 1678 |
Compare specifications (specs)
AMD Ryzen 5 3400G | Intel Core i9-8950HK | |
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Essentials |
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Architecture codename | Zen 2 | Coffee Lake |
Family | Ryzen | |
Launch date | 7 July 2019 | 3 March 2018 |
Launch price (MSRP) | $149 | $583 |
OPN PIB | YD3400C5FHBOX | |
OPN Tray | YD3400C5M4MFH | |
Place in performance rating | 1491 | 1736 |
Vertical segment | Desktop | Mobile |
Price now | $583 | |
Processor Number | i9-8950HK | |
Series | 8th Generation Intel® Core™ i9 Processors | |
Status | Launched | |
Value for money (0-100) | 7.32 | |
Performance |
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Base frequency | 3.7 GHz | 2.90 GHz |
L1 cache | 384 KB | 384 KB |
L2 cache | 2 MB | 1.5 MB |
L3 cache | 4 MB | 12 MB |
Manufacturing process technology | 12 nm | 14 nm |
Maximum core temperature | 95 °C | 100°C |
Maximum frequency | 4.2 GHz | 4.80 GHz |
Number of cores | 4 | 6 |
Number of GPU cores | 11 | |
Number of threads | 8 | 12 |
Unlocked | ||
64 bit support | ||
Bus Speed | 8 GT/s DMI | |
Die size | 149 mm | |
Maximum case temperature (TCase) | 72 °C | |
Memory |
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Max memory channels | 2 | 2 |
Supported memory frequency | 2933 MHz | |
Supported memory types | DDR4-2933 | DDR4-2666, LPDDR3-2133 |
Maximum memory bandwidth | 41.8 GB/s | |
Maximum memory size | 64 GB | |
Graphics |
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Graphics base frequency | 1400 MHz | 350 MHz |
iGPU core count | 11 | |
Processor graphics | Radeon RX Vega 11 Graphics | Intel® UHD Graphics 630 |
Device ID | 0x3E9B | |
Graphics max dynamic frequency | 1.20 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Graphics interfaces |
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DisplayPort | ||
HDMI | ||
DVI | ||
eDP | ||
Number of displays supported | 3 | |
Compatibility |
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Configurable TDP | 45-65 Watt | |
Sockets supported | AM4 | FCBGA1440 |
Thermal Design Power (TDP) | 65 Watt | 45 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 42mm x 28mm | |
Peripherals |
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PCI Express revision | 3.0 | 3.0 |
PCIe configurations | x8 | Up to 1x16, 2x8, 1x8+2x4 |
Max number of PCIe lanes | 16 | |
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@30Hz | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.5 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® Thermal Velocity Boost | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Speed Shift technology | ||
Thermal Monitoring | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |