AMD Ryzen 7 PRO 7730U vs AMD Ryzen 9 6900HX
Comparative analysis of AMD Ryzen 7 PRO 7730U and AMD Ryzen 9 6900HX processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the AMD Ryzen 7 PRO 7730U
- CPU is newer: launch date 1 year(s) 0 month(s) later
- 3x lower typical power consumption: 15 Watt vs 45 Watt
Launch date | 4 Jan 2023 vs Jan 2022 |
Thermal Design Power (TDP) | 15 Watt vs 45 Watt |
Reasons to consider the AMD Ryzen 9 6900HX
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- Around 9% higher clock speed: 4.9 GHz vs 4.5 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 6 nm vs 7 nm
- 1048576x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 12% better performance in PassMark - Single thread mark: 3442 vs 3073
- Around 30% better performance in PassMark - CPU mark: 24768 vs 18983
Specifications (specs) | |
Unlocked | Unlocked vs Locked |
Maximum frequency | 4.9 GHz vs 4.5 GHz |
Manufacturing process technology | 6 nm vs 7 nm |
L3 cache | 16 MB vs 16MB (shared) |
Benchmarks | |
PassMark - Single thread mark | 3442 vs 3073 |
PassMark - CPU mark | 24768 vs 18983 |
Compare benchmarks
CPU 1: AMD Ryzen 7 PRO 7730U
CPU 2: AMD Ryzen 9 6900HX
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen 7 PRO 7730U | AMD Ryzen 9 6900HX |
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PassMark - Single thread mark | 3073 | 3442 |
PassMark - CPU mark | 18983 | 24768 |
3DMark Fire Strike - Physics Score | 6849 |
Compare specifications (specs)
AMD Ryzen 7 PRO 7730U | AMD Ryzen 9 6900HX | |
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Essentials |
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Launch date | 4 Jan 2023 | Jan 2022 |
Place in performance rating | 555 | 549 |
Architecture codename | Zen 3+ | |
Vertical segment | Mobile | |
Performance |
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Base frequency | 2000 MHz | 3.3 GHz |
Die size | 180 mm² | 208 mm² |
L1 cache | 64K (per core) | 512 KB |
L2 cache | 512K (per core) | 4 MB |
L3 cache | 16MB (shared) | 16 MB |
Manufacturing process technology | 7 nm | 6 nm |
Maximum core temperature | 95°C | 95 °C |
Maximum frequency | 4.5 GHz | 4.9 GHz |
Number of cores | 8 | 8 |
Number of threads | 16 | 16 |
Transistor count | 10,700 million | |
Unlocked | ||
Memory |
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ECC memory support | ||
Supported memory types | DDR4-3200 MHz, Dual-channel | DDR5-4800 |
Max memory channels | 2 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | |
Sockets supported | FP6 | FP7 |
Thermal Design Power (TDP) | 15 Watt | 45 Watt |
Peripherals |
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PCIe configurations | Gen 3, 16 Lanes, (CPU only) | |
Max number of PCIe lanes | 20 | |
PCI Express revision | 4.0 | |
Graphics |
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Graphics max frequency | 2400 MHz | |
Advanced Technologies |
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AMD SenseMI | ||
AMD StoreMI technology | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Virtualization |
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AMD Virtualization (AMD-V™) |