AMD Ryzen 9 PRO 7945 vs Intel Xeon Gold 6136

Comparative analysis of AMD Ryzen 9 PRO 7945 and Intel Xeon Gold 6136 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD Ryzen 9 PRO 7945

Intel Xeon Gold 6136

Differences

Reasons to consider the AMD Ryzen 9 PRO 7945

Around 46% higher clock speed: 5.4 GHz vs 3.70 GHz
Around 12% higher maximum core temperature: 95°C vs 85°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 14 nm
2.3x lower typical power consumption: 65 Watt vs 150 Watt
Around 93% better performance in PassMark - Single thread mark: 4178 vs 2170
Around 37% better performance in PassMark - CPU mark: 47830 vs 34906

Specifications (specs)
Maximum frequency	5.4 GHz vs 3.70 GHz
Maximum core temperature	95°C vs 85°C
Manufacturing process technology	5 nm vs 14 nm
Thermal Design Power (TDP)	65 Watt vs 150 Watt
Benchmarks
PassMark - Single thread mark	4178 vs 2170
PassMark - CPU mark	47830 vs 34906

Compare benchmarks

CPU 1: AMD Ryzen 9 PRO 7945
CPU 2: Intel Xeon Gold 6136

PassMark - Single thread mark

CPU 1

CPU 2

4178

2170

PassMark - CPU mark

CPU 1

CPU 2

47830

34906

Name	AMD Ryzen 9 PRO 7945	Intel Xeon Gold 6136
PassMark - Single thread mark	4178	2170
PassMark - CPU mark	47830	34906
Geekbench 4 - Single Core		4351
Geekbench 4 - Multi-Core		31493

Compare specifications (specs)

	AMD Ryzen 9 PRO 7945	Intel Xeon Gold 6136
Essentials
Launch date	13 Jun 2023	Q3'17
Place in performance rating	76	75
Architecture codename		Skylake
Processor Number		6136
Series		Intel® Xeon® Scalable Processors
Status		Launched
Vertical segment		Server
Performance
Base frequency	3.7 GHz	3.00 GHz
Die size	2x 71 mm²
L1 cache	64K (per core)
L2 cache	1MB (per core)
L3 cache	64MB (shared)
Manufacturing process technology	5 nm	14 nm
Maximum case temperature (TCase)	47°C
Maximum core temperature	95°C	85°C
Maximum frequency	5.4 GHz	3.70 GHz
Number of cores	12	12
Number of threads	24	24
Transistor count	13,140 million
Unlocked
Number of Ultra Path Interconnect (UPI) Links		3
Memory
ECC memory support
Supported memory types	DDR5-5200 MHz, Dual-channel	DDR4-2666
Max memory channels		6
Maximum memory size		768 GB
Supported memory frequency		2666 MHz
Compatibility
Max number of CPUs in a configuration	1
Sockets supported	AM5	FCLGA3647
Thermal Design Power (TDP)	65 Watt	150 Watt
Low Halogen Options Available
Package Size		76.0mm x 56.5mm
Peripherals
PCIe configurations	Gen 5, 24 Lanes, (CPU only)
Max number of PCIe lanes		48
PCI Express revision		3.0
Scalability		S4S
Security & Reliability
Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Instruction set extensions		Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units		2
Speed Shift technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)