AMD Ryzen Embedded R1600 vs Intel Pentium 6805
Comparative analysis of AMD Ryzen Embedded R1600 and Intel Pentium 6805 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Ryzen Embedded R1600
- Around 3% higher clock speed: 3.1 GHz vs 3.00 GHz
- Around 5% higher maximum core temperature: 105 °C vs 100°C
- Around 20% more L1 cache; more data can be stored in the L1 cache for quick access later
Maximum frequency | 3.1 GHz vs 3.00 GHz |
Maximum core temperature | 105 °C vs 100°C |
L1 cache | 192 KB vs 160 KB |
Reasons to consider the Intel Pentium 6805
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 14 nm
- Around 6% better performance in PassMark - Single thread mark: 1834 vs 1724
- Around 35% better performance in PassMark - CPU mark: 4424 vs 3276
Specifications (specs) | |
Manufacturing process technology | 10 nm vs 14 nm |
Benchmarks | |
PassMark - Single thread mark | 1834 vs 1724 |
PassMark - CPU mark | 4424 vs 3276 |
Compare benchmarks
CPU 1: AMD Ryzen Embedded R1600
CPU 2: Intel Pentium 6805
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen Embedded R1600 | Intel Pentium 6805 |
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PassMark - Single thread mark | 1724 | 1834 |
PassMark - CPU mark | 3276 | 4424 |
Compare specifications (specs)
AMD Ryzen Embedded R1600 | Intel Pentium 6805 | |
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Essentials |
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Architecture codename | Zen | Ice Lake |
Launch date | 25 Feb 2020 | Q4'20 |
Place in performance rating | 1496 | 1390 |
Vertical segment | Mobile | Mobile |
Launch price (MSRP) | $161 | |
Processor Number | 6805 | |
Series | Intel Pentium Processor 6800 Series | |
Status | Launched | |
Performance |
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Base frequency | 2.6 GHz | 1.10 GHz |
Die size | 209.8 mm² | |
L1 cache | 192 KB | 160 KB |
L2 cache | 1 MB | 1 MB |
L3 cache | 4 MB | 4 MB |
Manufacturing process technology | 14 nm | 10 nm |
Maximum core temperature | 105 °C | 100°C |
Maximum frequency | 3.1 GHz | 3.00 GHz |
Number of cores | 2 | 2 |
Number of threads | 4 | 4 |
Transistor count | 4950 million | |
Unlocked | ||
64 bit support | ||
Memory |
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ECC memory support | ||
Max memory channels | 2 | 2 |
Supported memory types | DDR4-2400 | DDR4-3200, LPDDR4-3733 |
Maximum memory size | 64 GB | |
Compatibility |
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Configurable TDP-down | 12 Watt | |
Configurable TDP-up | 25 Watt | |
Max number of CPUs in a configuration | 1 | 1 |
Socket Count | FP5 | |
Thermal Design Power (TDP) | 15 Watt | 15 Watt |
Package Size | 50mm x 25mm | |
Sockets supported | FCBGA1526 | |
Peripherals |
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Max number of PCIe lanes | 8 | |
PCI Express revision | 3.0 | |
Graphics |
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Execution Units | 32 | |
Graphics base frequency | 300 MHz | |
Graphics max dynamic frequency | 850 MHz | |
Graphics max frequency | 850 MHz | |
Processor graphics | Intel UHD Graphics for 10th Gen Intel Processors | |
Graphics interfaces |
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Number of displays supported | 3 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |