AMD Ryzen Embedded R2514 vs AMD Ryzen 3 PRO 3200G
Comparative analysis of AMD Ryzen Embedded R2514 and AMD Ryzen 3 PRO 3200G processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Ryzen Embedded R2514
- CPU is newer: launch date 3 year(s) 0 month(s) later
- 4 more threads: 8 vs 4
- Around 11% higher maximum core temperature: 105°C vs 95 °C
- 4.3x lower typical power consumption: 15 Watt vs 65 Watt
- Around 6% better performance in PassMark - CPU mark: 6883 vs 6506
| Specifications (specs) | |
| Launch date | 30 Sep 2022 vs 30 Sep 2019 |
| Number of threads | 8 vs 4 |
| Maximum core temperature | 105°C vs 95 °C |
| Thermal Design Power (TDP) | 15 Watt vs 65 Watt |
| Benchmarks | |
| PassMark - CPU mark | 6883 vs 6506 |
Reasons to consider the AMD Ryzen 3 PRO 3200G
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- Around 8% higher clock speed: 4 GHz vs 3.7 GHz
- Around 4% better performance in PassMark - Single thread mark: 2117 vs 2037
| Specifications (specs) | |
| Unlocked | Unlocked vs Locked |
| Maximum frequency | 4 GHz vs 3.7 GHz |
| Benchmarks | |
| PassMark - Single thread mark | 2117 vs 2037 |
Compare benchmarks
CPU 1: AMD Ryzen Embedded R2514
CPU 2: AMD Ryzen 3 PRO 3200G
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | AMD Ryzen Embedded R2514 | AMD Ryzen 3 PRO 3200G |
|---|---|---|
| PassMark - Single thread mark | 2037 | 2117 |
| PassMark - CPU mark | 6883 | 6506 |
Compare specifications (specs)
| AMD Ryzen Embedded R2514 | AMD Ryzen 3 PRO 3200G | |
|---|---|---|
Essentials |
||
| Launch date | 30 Sep 2022 | 30 Sep 2019 |
| Place in performance rating | 1212 | 1189 |
| Family | Ryzen PRO | |
| OPN Tray | YD320BC5M4MFH | |
| Vertical segment | Desktop | |
Performance |
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| Base frequency | 2.1 GHz | 3.6 GHz |
| Die size | 210 mm² | |
| L1 cache | 96 KB (per core) | 384 KB |
| L2 cache | 512 KB (per core) | 2 MB |
| L3 cache | 4 MB (shared) | 4 MB |
| Manufacturing process technology | 12 nm | 12 nm |
| Maximum core temperature | 105°C | 95 °C |
| Maximum frequency | 3.7 GHz | 4 GHz |
| Number of cores | 4 | 4 |
| Number of threads | 8 | 4 |
| Transistor count | 4,940 million | |
| Unlocked | ||
| Number of GPU cores | 8 | |
Memory |
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| ECC memory support | ||
| Supported memory types | DDR4 | DDR4-2933 |
| Max memory channels | 2 | |
| Supported memory frequency | 2933 MHz | |
Compatibility |
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| Configurable TDP | 12-35 Watt | 45-65 Watt |
| Max number of CPUs in a configuration | 1 | |
| Sockets supported | FP5 | AM4 |
| Thermal Design Power (TDP) | 15 Watt | 65 Watt |
Peripherals |
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| PCIe configurations | Gen 3, 16 Lanes, (CPU only) | |
| PCI Express revision | 3.0 | |
Graphics |
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| Graphics base frequency | 1250 MHz | |
| iGPU core count | 8 | |
| Processor graphics | Radeon Vega 8 Graphics | |
Graphics interfaces |
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| DisplayPort | ||
| HDMI | ||
