AMD Ryzen Embedded V1500B vs Intel Core i3-4330TE
Comparative analysis of AMD Ryzen Embedded V1500B and Intel Core i3-4330TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Peripherals, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Ryzen Embedded V1500B
- 2 more cores, run more applications at once: 4 vs 2
- 4 more threads: 8 vs 4
- Around 46% higher maximum core temperature: 105 °C vs 72°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- 2.2x lower typical power consumption: 16 Watt vs 35 Watt
- 2.3x better performance in PassMark - CPU mark: 4633 vs 2022
Specifications (specs) | |
Number of cores | 4 vs 2 |
Number of threads | 8 vs 4 |
Maximum core temperature | 105 °C vs 72°C |
Manufacturing process technology | 14 nm vs 22 nm |
Thermal Design Power (TDP) | 16 Watt vs 35 Watt |
Benchmarks | |
PassMark - CPU mark | 4633 vs 2022 |
Reasons to consider the Intel Core i3-4330TE
- Around 10% better performance in PassMark - Single thread mark: 1327 vs 1211
Benchmarks | |
PassMark - Single thread mark | 1327 vs 1211 |
Compare benchmarks
CPU 1: AMD Ryzen Embedded V1500B
CPU 2: Intel Core i3-4330TE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen Embedded V1500B | Intel Core i3-4330TE |
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PassMark - Single thread mark | 1211 | 1327 |
PassMark - CPU mark | 4633 | 2022 |
Compare specifications (specs)
AMD Ryzen Embedded V1500B | Intel Core i3-4330TE | |
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Essentials |
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Architecture codename | Zen | Haswell |
Launch date | 2018 | Q3'13 |
OPN Tray | YE1500C4T4MFB | |
Place in performance rating | 1938 | 1896 |
Vertical segment | Embedded | Embedded |
Processor Number | i3-4330TE | |
Series | 4th Generation Intel® Core™ i3 Processors | |
Status | Launched | |
Performance |
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64 bit support | ||
Base frequency | 2.2 GHz | 2.40 GHz |
L1 cache | 384 KB | |
L2 cache | 2 MB | |
L3 cache | 4 MB | |
Manufacturing process technology | 14 nm | 22 nm |
Maximum core temperature | 105 °C | 72°C |
Number of cores | 4 | 2 |
Number of threads | 8 | 4 |
Bus Speed | 5 GT/s DMI2 | |
Memory |
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ECC memory support | ||
Max memory channels | 2 | 2 |
Maximum memory size | 32 GB | 32 GB |
Supported memory types | DDR4-2400 | DDR3 1333/1600 |
Maximum memory bandwidth | 25.6 GB/s | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | FP5 | FCLGA1150 |
Thermal Design Power (TDP) | 16 Watt | 35 Watt |
Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | |
Thermal Solution | PCG 2013A | |
Advanced Technologies |
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Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | |
Intel 64 | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics |
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Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.00 GHz | |
Intel® Clear Video HD technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 1.7 GB | |
Processor graphics | Intel® HD Graphics 4600 | |
Graphics interfaces |
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Number of displays supported | 3 | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | |
PCIe configurations | Up to 1x16, 2x8, 1x8/2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) |