AMD Ryzen Embedded V1500B vs Intel Core i3-4330TE

Comparative analysis of AMD Ryzen Embedded V1500B and Intel Core i3-4330TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Peripherals, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Ryzen Embedded V1500B

  • 2 more cores, run more applications at once: 4 vs 2
  • 4 more threads: 8 vs 4
  • Around 46% higher maximum core temperature: 105 °C vs 72°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
  • 2.2x lower typical power consumption: 16 Watt vs 35 Watt
  • 2.3x better performance in PassMark - CPU mark: 4633 vs 2022
Specifications (specs)
Number of cores 4 vs 2
Number of threads 8 vs 4
Maximum core temperature 105 °C vs 72°C
Manufacturing process technology 14 nm vs 22 nm
Thermal Design Power (TDP) 16 Watt vs 35 Watt
Benchmarks
PassMark - CPU mark 4633 vs 2022

Reasons to consider the Intel Core i3-4330TE

  • Around 10% better performance in PassMark - Single thread mark: 1327 vs 1211
Benchmarks
PassMark - Single thread mark 1327 vs 1211

Compare benchmarks

CPU 1: AMD Ryzen Embedded V1500B
CPU 2: Intel Core i3-4330TE

PassMark - Single thread mark
CPU 1
CPU 2
1211
1327
PassMark - CPU mark
CPU 1
CPU 2
4633
2022
Name AMD Ryzen Embedded V1500B Intel Core i3-4330TE
PassMark - Single thread mark 1211 1327
PassMark - CPU mark 4633 2022

Compare specifications (specs)

AMD Ryzen Embedded V1500B Intel Core i3-4330TE

Essentials

Architecture codename Zen Haswell
Launch date 2018 Q3'13
OPN Tray YE1500C4T4MFB
Place in performance rating 1938 1895
Vertical segment Embedded Embedded
Processor Number i3-4330TE
Series 4th Generation Intel® Core™ i3 Processors
Status Launched

Performance

64 bit support
Base frequency 2.2 GHz 2.40 GHz
L1 cache 384 KB
L2 cache 2 MB
L3 cache 4 MB
Manufacturing process technology 14 nm 22 nm
Maximum core temperature 105 °C 72°C
Number of cores 4 2
Number of threads 8 4
Bus Speed 5 GT/s DMI2

Memory

ECC memory support
Max memory channels 2 2
Maximum memory size 32 GB 32 GB
Supported memory types DDR4-2400 DDR3 1333/1600
Maximum memory bandwidth 25.6 GB/s

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported FP5 FCLGA1150
Thermal Design Power (TDP) 16 Watt 35 Watt
Low Halogen Options Available
Package Size 37.5mm x 37.5mm
Thermal Solution PCG 2013A

Advanced Technologies

Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX
Intel 64
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Graphics

Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.00 GHz
Intel® Clear Video HD technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory 1.7 GB
Processor graphics Intel® HD Graphics 4600

Graphics interfaces

Number of displays supported 3

Peripherals

Max number of PCIe lanes 16
PCI Express revision 3.0
PCIe configurations Up to 1x16, 2x8, 1x8/2x4
Scalability 1S Only

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)