AMD Sempron 3500+ EE SFF vs Intel Celeron D 352
Comparative analysis of AMD Sempron 3500+ EE SFF and Intel Celeron D 352 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Memory, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Sempron 3500+ EE SFF
- 8x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2.5x lower typical power consumption: 35 Watt vs 86 Watt
L1 cache | 128 KB vs 16 KB |
Thermal Design Power (TDP) | 35 Watt vs 86 Watt |
Reasons to consider the Intel Celeron D 352
- Around 60% higher clock speed: 3.2 GHz vs 2 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency | 3.2 GHz vs 2 GHz |
Manufacturing process technology | 65 nm vs 90 nm |
L2 cache | 512 KB vs 128 KB |
Compare benchmarks
CPU 1: AMD Sempron 3500+ EE SFF
CPU 2: Intel Celeron D 352
Name | AMD Sempron 3500+ EE SFF | Intel Celeron D 352 |
---|---|---|
PassMark - Single thread mark | 576 | |
PassMark - CPU mark | 274 |
Compare specifications (specs)
AMD Sempron 3500+ EE SFF | Intel Celeron D 352 | |
---|---|---|
Essentials |
||
Architecture codename | Manila | Cedarmill |
Launch date | May 2006 | May 2006 |
Place in performance rating | not rated | 2882 |
Vertical segment | Desktop | Desktop |
Processor Number | 352 | |
Series | Legacy Intel® Celeron® Processor | |
Status | Discontinued | |
Performance |
||
64 bit support | ||
Die size | 103 mm | 81 mm2 |
L1 cache | 128 KB | 16 KB |
L2 cache | 128 KB | 512 KB |
Manufacturing process technology | 90 nm | 65 nm |
Maximum frequency | 2 GHz | 3.2 GHz |
Number of cores | 1 | 1 |
Transistor count | 81 million | 188 million |
Base frequency | 3.20 GHz | |
Bus Speed | 533 MHz FSB | |
Maximum core temperature | 69.2°C | |
VID voltage range | 1.25V-1.325V | |
Compatibility |
||
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | AM2 | PLGA775 |
Thermal Design Power (TDP) | 35 Watt | 86 Watt |
Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | |
Memory |
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Supported memory types | DDR1, DDR2, DDR3 | |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 32-bit | |
Virtualization |
||
Intel® Virtualization Technology (VT-x) |