AMD Sempron 3500+ EE SFF vs Intel Core Duo T2250
Comparative analysis of AMD Sempron 3500+ EE SFF and Intel Core Duo T2250 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Memory, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Sempron 3500+ EE SFF
- Around 16% higher clock speed: 2 GHz vs 1.73 GHz
Maximum frequency | 2 GHz vs 1.73 GHz |
Reasons to consider the Intel Core Duo T2250
- 1 more cores, run more applications at once: 2 vs 1
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
- 16x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 13% lower typical power consumption: 31 Watt vs 35 Watt
Number of cores | 2 vs 1 |
Manufacturing process technology | 65 nm vs 90 nm |
L2 cache | 2048 KB vs 128 KB |
Thermal Design Power (TDP) | 31 Watt vs 35 Watt |
Compare benchmarks
CPU 1: AMD Sempron 3500+ EE SFF
CPU 2: Intel Core Duo T2250
Name | AMD Sempron 3500+ EE SFF | Intel Core Duo T2250 |
---|---|---|
PassMark - Single thread mark | 530 | |
PassMark - CPU mark | 350 |
Compare specifications (specs)
AMD Sempron 3500+ EE SFF | Intel Core Duo T2250 | |
---|---|---|
Essentials |
||
Architecture codename | Manila | Yonah |
Launch date | May 2006 | May 2006 |
Place in performance rating | not rated | 2940 |
Vertical segment | Desktop | Mobile |
Processor Number | T2250 | |
Series | Legacy Intel® Core™ Processors | |
Status | Discontinued | |
Performance |
||
64 bit support | ||
Die size | 103 mm | 90 mm2 |
L1 cache | 128 KB | |
L2 cache | 128 KB | 2048 KB |
Manufacturing process technology | 90 nm | 65 nm |
Maximum frequency | 2 GHz | 1.73 GHz |
Number of cores | 1 | 2 |
Transistor count | 81 million | 151 million |
Base frequency | 1.73 GHz | |
Bus Speed | 533 MHz FSB | |
Front-side bus (FSB) | 533 MHz | |
Maximum core temperature | 100°C | |
Number of threads | 2 | |
VID voltage range | 0.7625-1.3V | |
Compatibility |
||
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | AM2 | PPGA478 |
Thermal Design Power (TDP) | 35 Watt | 31 Watt |
Low Halogen Options Available | ||
Package Size | 35mm x 35mm | |
Memory |
||
Supported memory types | DDR1 | |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 32-bit | |
Virtualization |
||
Intel® Virtualization Technology (VT-x) |