AMD Sempron 3500+ EE SFF vs Intel Core Duo T2250

Comparative analysis of AMD Sempron 3500+ EE SFF and Intel Core Duo T2250 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Memory, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Sempron 3500+ EE SFF

  • Around 16% higher clock speed: 2 GHz vs 1.73 GHz
Maximum frequency 2 GHz vs 1.73 GHz

Reasons to consider the Intel Core Duo T2250

  • 1 more cores, run more applications at once: 2 vs 1
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
  • 16x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 13% lower typical power consumption: 31 Watt vs 35 Watt
Number of cores 2 vs 1
Manufacturing process technology 65 nm vs 90 nm
L2 cache 2048 KB vs 128 KB
Thermal Design Power (TDP) 31 Watt vs 35 Watt

Compare benchmarks

CPU 1: AMD Sempron 3500+ EE SFF
CPU 2: Intel Core Duo T2250

Name AMD Sempron 3500+ EE SFF Intel Core Duo T2250
PassMark - Single thread mark 530
PassMark - CPU mark 350

Compare specifications (specs)

AMD Sempron 3500+ EE SFF Intel Core Duo T2250

Essentials

Architecture codename Manila Yonah
Launch date May 2006 May 2006
Place in performance rating not rated 2940
Vertical segment Desktop Mobile
Processor Number T2250
Series Legacy Intel® Core™ Processors
Status Discontinued

Performance

64 bit support
Die size 103 mm 90 mm2
L1 cache 128 KB
L2 cache 128 KB 2048 KB
Manufacturing process technology 90 nm 65 nm
Maximum frequency 2 GHz 1.73 GHz
Number of cores 1 2
Transistor count 81 million 151 million
Base frequency 1.73 GHz
Bus Speed 533 MHz FSB
Front-side bus (FSB) 533 MHz
Maximum core temperature 100°C
Number of threads 2
VID voltage range 0.7625-1.3V

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported AM2 PPGA478
Thermal Design Power (TDP) 35 Watt 31 Watt
Low Halogen Options Available
Package Size 35mm x 35mm

Memory

Supported memory types DDR1

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 32-bit

Virtualization

Intel® Virtualization Technology (VT-x)

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