AMD Sempron X2 2200 vs Intel Pentium D 840 EE

Comparative analysis of AMD Sempron X2 2200 and Intel Pentium D 840 EE processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Memory, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Sempron X2 2200

Intel Pentium D 840 EE

Differences

Reasons to consider the AMD Sempron X2 2200

CPU is newer: launch date 2 year(s) 9 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
4.6x more L1 cache, more data can be stored in the L1 cache for quick access later
2x lower typical power consumption: 65 Watt vs 130 Watt

Launch date	March 2008 vs May 2005
Manufacturing process technology	65 nm vs 90 nm
L1 cache	128 KB vs 28 KB
Thermal Design Power (TDP)	65 Watt vs 130 Watt

Reasons to consider the Intel Pentium D 840 EE

Around 60% higher clock speed: 3.2 GHz vs 2 GHz
8x more L2 cache, more data can be stored in the L2 cache for quick access later

Maximum frequency	3.2 GHz vs 2 GHz
L2 cache	2048 KB vs 256 KB

Compare benchmarks

CPU 1: AMD Sempron X2 2200
CPU 2: Intel Pentium D 840 EE

Name	AMD Sempron X2 2200	Intel Pentium D 840 EE
PassMark - Single thread mark	578
PassMark - CPU mark	995

Compare specifications (specs)

	AMD Sempron X2 2200	Intel Pentium D 840 EE
Essentials
Architecture codename	Brisbane	Smithfield
Launch date	March 2008	May 2005
Place in performance rating	2862	not rated
Vertical segment	Desktop	Desktop
Processor Number		840
Series		Legacy Intel® Pentium® Processor
Status		Discontinued
Performance
64 bit support
Die size	118 mm	206 mm2
L1 cache	128 KB	28 KB
L2 cache	256 KB	2048 KB
Manufacturing process technology	65 nm	90 nm
Maximum frequency	2 GHz	3.2 GHz
Number of cores	2	2
Transistor count	221 million	230 million
Base frequency		3.20 GHz
Bus Speed		800 MHz FSB
Maximum core temperature		69.8°C
VID voltage range		1.200-1.400V
Compatibility
Max number of CPUs in a configuration	2	2
Sockets supported	AM2	PLGA775
Thermal Design Power (TDP)	65 Watt	130 Watt
Low Halogen Options Available
Package Size		37.5mm x 37.5mm
Memory
Supported memory types		DDR1, DDR2, DDR3
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE)		32-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)