Intel Atom C2750 vs Intel Pentium D 840 EE

Comparative analysis of Intel Atom C2750 and Intel Pentium D 840 EE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Atom C2750

Intel Pentium D 840 EE

Differences

Reasons to consider the Intel Atom C2750

6 more cores, run more applications at once: 8 vs 2
Around 39% higher maximum core temperature: 97°C vs 69.8°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 90 nm
6.5x lower typical power consumption: 20 Watt vs 130 Watt

Number of cores	8 vs 2
Maximum core temperature	97°C vs 69.8°C
Manufacturing process technology	22 nm vs 90 nm
Thermal Design Power (TDP)	20 Watt vs 130 Watt

Reasons to consider the Intel Pentium D 840 EE

Around 23% higher clock speed: 3.2 GHz vs 2.60 GHz

Maximum frequency	3.2 GHz vs 2.60 GHz

Compare benchmarks

CPU 1: Intel Atom C2750
CPU 2: Intel Pentium D 840 EE

Name	Intel Atom C2750	Intel Pentium D 840 EE
PassMark - Single thread mark	693
PassMark - CPU mark	2787
Geekbench 4 - Single Core	215
Geekbench 4 - Multi-Core	1458

Compare specifications (specs)

	Intel Atom C2750	Intel Pentium D 840 EE
Essentials
Architecture codename	Avoton	Smithfield
Launch date	Q3'13	May 2005
Place in performance rating	2883	not rated
Processor Number	C2750	840
Series	Intel® Atom™ Processor C Series	Legacy Intel® Pentium® Processor
Status	Launched	Discontinued
Vertical segment	Server	Desktop
Performance
64 bit support
Base frequency	2.40 GHz	3.20 GHz
Manufacturing process technology	22 nm	90 nm
Maximum core temperature	97°C	69.8°C
Maximum frequency	2.60 GHz	3.2 GHz
Number of cores	8	2
Number of threads	8
Bus Speed		800 MHz FSB
Die size		206 mm2
L1 cache		28 KB
L2 cache		2048 KB
Transistor count		230 million
VID voltage range		1.200-1.400V
Memory
Max memory channels	2
Maximum memory bandwidth	25.6 GB/s
Maximum memory size	64 GB
Supported memory types	DDR3/DDR3L 1600	DDR1, DDR2, DDR3
Compatibility
Low Halogen Options Available
Package Size	34 mm x 28 mm	37.5mm x 37.5mm
Sockets supported	FCBGA1283	PLGA775
Thermal Design Power (TDP)	20 Watt	130 Watt
Max number of CPUs in a configuration		2
Peripherals
Integrated LAN
Max number of PCIe lanes	16
Max number of SATA 6 Gb/s Ports	2
Number of USB ports	4
PCI Express revision	2
PCIe configurations	x1,x2,x4,x8,x16
Total number of SATA ports	6
UART
USB revision	2
Advanced Technologies
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE)	36-bit	32-bit
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® VT-x with Extended Page Tables (EPT)
Intel® Virtualization Technology for Directed I/O (VT-d)
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)